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Post cure behaviour of ancapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator

Post cure behaviour of ancapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator

Pavuluri, S.K., Desmulliez, M.P.Y., Goussetis, G., Arrighi, V., Johnston, K., Adamietz, R., Tilford, T. and Bailey, C. (2012) Post cure behaviour of ancapsulants for QFN packages processed by an open-ended single mode resonant microwave applicator. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 573-578. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online) (doi:10.1109/EPTC.2011.6184486)

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Abstract

An open-ended single mode resonant microwave applicator has been developed for the curing of encapsulants materials used for microelectronic packaging. Post cure behaviour of HenkelTM E01080 encapsulant material has been studied by Differential Scanning Calorimetry (DSC), Attenuated Total Reflectance Fourier-Transform Infrared (ATR-FTIR) analysis and Dynamic Mechanical Analysis (DMA). DSC based measurement of the microwave cured samples indicates a ~ 99.2% degree of cure and a glass transition temperature, Tg, of 113oC for a sample cured at 150oC for 90 seconds. For the corresponding convection oven cured sample the degree of cure was found to be approximately 70% for the same duration of cure. The ATRFTIR analysis showed no significant difference between the conventionally and microwave cured samples. Thermal ageing analysis performed on fully conventional and microwave cured samples showed similar ageing behaviour for both samples at a given temperature under Tg.

Item Type: Conference Proceedings
Title of Proceedings: Electronics Packaging Technology Conference (EPTC), 2011 13th
Additional Information: [1] First available online: 19 April 2012. [2] This paper was presented at the 13th Electronics Packaging Technology Conference (EPTC 2011), held from 7-9 December 2011 in Singapore. EPTC 2011 was organized by the IEEE Reliability/CPMT/ED Singapore Chapter and sponsored by the IEEE CPMT Society. [3] INSPEC Accession Number: 12691513
Uncontrolled Keywords: encapsulants, resonant microwave applicator, curing, electromagnetic heating, materials, microwave measurements, microwave ovens, microwave theory and techniques, temperature measurement
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering
Pre-2014 Departments: School of Computing & Mathematical Sciences
Related URLs:
Last Modified: 14 Oct 2016 09:18
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
URI: http://gala.gre.ac.uk/id/eprint/7099

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