Assessment of the accuracy of cure kinetics models and fitting approaches utilised in analysis of microelectronics encapsulation materials
Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S.K., Desmulliez, M.P.Y. and Bailey, C. (2012) Assessment of the accuracy of cure kinetics models and fitting approaches utilised in analysis of microelectronics encapsulation materials. In: Electronics Packaging Technology Conference (EPTC), 2011 13th. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 262-267. ISBN 978-1-4577-1983-7 (Print), 978-1-4577-1981-3 (Online)Full text not available from this repository.
The accuracy of four widely used cure kinetics models in predicting the cure rate of a commercially available encapsulant material is assessed. Four nth order phenomenological cure kinetics models and the single step autocatalytic model are outlined. These models are fitted to Differential Scanning Calorimetry data using two differing approaches. The Borchardt-Daniels approach is outlined and utilised in conjunction with a Levenberg Marquardt solver to determine model coefficients correlating the models to the experimental data. A particle swarm optimization approach to model fitting is also outlined and is used to develop an alternate set of model coefficients. The accuracy of each of the models combined with each of the fitting methods is defined using an error metric. Optimal model coefficients and related error metric data are presented. The results obtained indicate that the particle swarm optimization approach is able to fit the models more closely to the experimental data, resulting in lower error values than the Borchardt Daniels fitted data. The single step model is also shown to approximate the cure kinetics of the encapsulant material more closely than the nth order models.
|Item Type:||Conference Proceedings|
|Title of Proceedings:||Electronics Packaging Technology Conference (EPTC), 2011 13th|
|Additional Information:|| First published online: 19 April 2012  This paper was presented at the 13th Electronics Packaging Technology Conference (EPTC 2011), held from 7-9 December 2011 in Singapore. EPTC 2011 was organized by the IEEE Reliability/CPMT/ED Singapore Chapter and sponsored by IEEE CPMT Society.  INSPEC Accession Number: 12691455|
|Uncontrolled Keywords:||cure kinetics models, encapsulant material|
|Subjects:||T Technology > TK Electrical engineering. Electronics Nuclear engineering|
|School / Department / Research Groups:||School of Computing & Mathematical Sciences|
|Last Modified:||14 Jan 2013 10:29|
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