Skip navigation

Investigating the effects of area ratio and aspect ratio on stencil printing process used in the electronics assembly line

Investigating the effects of area ratio and aspect ratio on stencil printing process used in the electronics assembly line

Mallik, Sabuj and Ekere, Ndy (2011) Investigating the effects of area ratio and aspect ratio on stencil printing process used in the electronics assembly line. In: International Conference on Electronics Packaging (ICEP) 2011, 13-15 April 2011, Nara Prefectural New Public Hall, Nara, Japan.

Full text not available from this repository.

Abstract

Stencil printing is the widely used method for depositing solder paste in the surface mount technology (SMT) assembly process. The aim of this study is to investigate the effect two important factors namely area ratio and aspect ratio in the stencil printing process. Taguchi’s orthogonal arrays are used to design the experiments. A total of four factors (with two levels) are considered in the experimental design. The print speed and print pressure are the two other factors considered in the study. The solder paste deposit heights were measured and recorded as response. The results were analysed by performing Analysis of Variance (ANOVA) and creating main-effects plots and response surface curves to check for any interactions and to optimize the response output. The results were also compared to work done by previous researchers and discussed critically. The ‘area ratio’ and ‘print speed’ are identified as the most important factors and there is strong interaction evidenced between ‘print speed’ and ‘aspect ratio’. The response is optimized for maximum performance and to reduce the defects from the stencil printing process.

Item Type: Conference or Conference Paper (Paper)
Additional Information: Paper presented at the International Conference on Electronics Packaging 2011 held from 13-15 April 2011 in Nara, Japan. Conference organized by the Japan Institute of Electronics Packaging (JIEP) and International Conference on Electronics Packaging (ICEP).
Uncontrolled Keywords: stencil printing, solder paste, design of experiments
Subjects: N Fine Arts > NE Print media
T Technology > T Technology (General)
T Technology > TK Electrical engineering. Electronics Nuclear engineering
Pre-2014 Departments: School of Engineering > Manufacturing Engineering Research Group
Related URLs:
Last Modified: 14 Oct 2016 09:17
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
URI: http://gala.gre.ac.uk/id/eprint/6586

Actions (login required)

View Item View Item