Evaluating the effect of pad sizes on the inter-metallic layer formation and growth for Sn-Ag-Cu solders on Cu metallization
Bernasko, Peter, Mallik, Sabuj, Ekere, Ndy and Takyi, G. (2011) Evaluating the effect of pad sizes on the inter-metallic layer formation and growth for Sn-Ag-Cu solders on Cu metallization. In: International Conference on Electronics Packaging (ICEP) 2011, 13-15 April 2011, Nara Prefectural New Public Hall, Nara, Japan.Full text not available from this repository.
This paper reports on an investigation of the effect of pad sizes on inter-metallic layer formation and thickness for Sn-Ag-Cu solder pastes reflowed on Cu-metallization. For lead-free soldering this could prove to be very important, as a wide range of devices and components of varying joint may need to be assembled on a typical board. This means that the nature and thickness of the inter-metallic layer formed for each joint size will be different. In the study, solder joints of different pad sizes representing different devices were used for evaluating the effect of solder volume on inter-metallic compound formation. In our previous study of the effect of solder volume on IMC formation and growth, we found that increasing the solder volume does not significantly affect the growth on the IMC thickness. This result identified the need for further investigation looking at specific geometries used in real-life assembly (at flip-chip, CSP, BGA and conventional SMT levels). The current study aims to consolidate and extend on the previous research findings. Five different pad sizes were used to investigate and evaluate inter-metallic formation and growth at these pad geometries. The reflowed solder joints have been isothermally aged for 100, 200 and 300 hours at 1750C. The inter-metallic layer thickness and microstructure were then analysed using scanning electron microscopy (SEM) and X-ray diffraction analysis. The techniques used for this study and the results will be of interest to the research and development personnel, operators and managers in the electronic industry as they work to improve lead-free process yield, product quality and reliability.
|Item Type:||Conference or Conference Paper (Paper)|
|Additional Information:||Paper presented at the International Conference on Electronics Packaging (ICEP) 2011 held in Nara Prefectural New Public Hall, Nara, Japan from 13-15 April 2011. Conference organized by the Japan Institute of Electronics Packaging (JIEP) and International Conference on Electronics Packaging (ICEP).|
|Uncontrolled Keywords:||solder joint, interface materials, ageing|
|Subjects:||Q Science > QC Physics
Q Science > QD Chemistry
T Technology > T Technology (General)
|Pre-2014 Departments:||School of Engineering
School of Engineering > Manufacturing Engineering Research Group
|Last Modified:||14 Oct 2016 09:17|
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