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Thermal management materials for electronic control unit: trends, processing technology and R&D challenges

Thermal management materials for electronic control unit: trends, processing technology and R&D challenges

Otiaba, K.C., Ekere, N.N., Amalu, E.H., Bhatti, R.S. and Mallik, S. (2010) Thermal management materials for electronic control unit: trends, processing technology and R&D challenges. In: International Conference on Engineering Research & Development: Advances in Engineering Science & Technology, 7-9 September 2010, Benin City, Africa.

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Abstract

The development of advanced thermal management materials for Electronic Control Unit (ECU) is the key to achieving high reliability and thus safety critical operations in areas of ECU applications such as automotives and power systems. Thermal management issues associated with the operation of ECU at elevated temperature have accounted for some of the recent reliability concerns which have culminated in current systems failures in some automobiles. As the functions of ECU in systems have increased in recent times, the number of components per unit area on its board has also risen. High board density boosts internal heat generated per unit time in ECU ambient. The generated heat induces stress and strain at the chip interconnects due to variation in the Coefficient of Thermal Expansion (CTE) and thermal conductivity of different bonded materials in the assembly. Thermal degradation impacts device’s efficiency and could become critical. The life expectancy of electronic components reduces exponentially as the operating temperature rises, thus making thermal management pivotal in electronic system reliability. Since materials’ properties vary with operating condition, material performance has become a major consideration in the design of heat dissipation mechanism in ECU. The development of advanced thermal management materials and hence improving the performance of ECU require an in-depth understanding of the complex relationship between materials’ properties and their behaviours at elevated temperatures. The paper presents an overview of thermal management materials for ECU in terms of material properties and processing technology. In addition, the paper outlines the crucial challenges in materials selection, including cost and manufacturing and other outstanding R & D issues.

Item Type: Conference or Conference Paper (Paper)
Additional Information: [1] Paper presented at 3rd International Conference on Engineering Research & Development: Advances in Engineering Science & Technology, held 7-9 September 2010, Benin City, Nigeria.
Uncontrolled Keywords: thermal management, electronic control unit, materials, processing technology
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering
Pre-2014 Departments: School of Engineering
School of Engineering > Department of Engineering Systems
Related URLs:
Last Modified: 14 Oct 2016 09:16
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
URI: http://gala.gre.ac.uk/id/eprint/6431

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