High temperature electronics: R&D challenges and trends in materials, packaging and interconnection technology
Amalu, E.H., Ekere, N.N. and Bhatti, R.S. (2010) High temperature electronics: R&D challenges and trends in materials, packaging and interconnection technology. In: 2nd International Conference on Adaptive Science & Technology, 2009. (ICAST 2009). Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 146-153. ISBN 978-1-4244-3522-7 ISSN 0855-8906Full text not available from this repository.
The development of new high temperature electronics (HTE)/systems is the key to achieving high reliability safety critical operations in aerospace, automotive and well-logging applications. Reliability issues associated with the operation of HTE devices have been shown to account for some of the recent aircraft crashes as well as failures of the electronic control Unit in modern vehicles. The reliability of electronic systems is partly dependent on its operating ambient conditions; and reliability generally decreases in harsh operating conditions. The life expectancy of components and systems is known to reduce exponentially as the operating temperature increases; adversely impacting long-term system reliability. As under-bonnet, aerospace and well-logging applications require the direct exposure of sensors to very harsh conditions – these applications demand new HTE systems which can operate reliably in harsh conditions whilst preserving their properties/functions over long operating periods. The packaging and interconnection of the new HTE systems requires better understanding of the complex interactions between HTE system parameters and specific environmental conditions. The paper presents an overview of HTE research, reviews the trends in materials, component packaging and interconnect technology. The paper also outlines the key challenges in HTE research and the outstanding R&D issues.
|Item Type:||Conference Proceedings|
|Title of Proceedings:||2nd International Conference on Adaptive Science & Technology, 2009. (ICAST 2009)|
|Additional Information:|| Paper presented at the 2nd International Conference on Adaptive Science & Technology, 2009. (ICAST 2009) held in Accra, Ghana from 14-16 January 2009. INSPEC Accession Number: 11107672.|
|Uncontrolled Keywords:||HTE, miniaturization, materials, packaging|
|Subjects:||T Technology > TA Engineering (General). Civil engineering (General)|
|School / Department / Research Groups:||School of Engineering|
|Last Modified:||12 Mar 2012 16:47|
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