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Investigation of the effects of reflow profile parameters on lead-free solder bump volumes and joint integrity

Investigation of the effects of reflow profile parameters on lead-free solder bump volumes and joint integrity

Amalu, Emeka H., Lui, Y.T., Ekere, Ndy, Bhatti, R.S. and Takyi, G. (2011) Investigation of the effects of reflow profile parameters on lead-free solder bump volumes and joint integrity. In: AIP Conference Proceedings. American Institute of Physics, Melville, NY, USA, pp. 639-644. (doi:10.1063/1.3552519)

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Abstract

The electronics manufacturing industry was quick to adopt and use the Surface Mount Technology (SMT) assembly technique on realization of its huge potentials in achieving smaller, lighter and low cost product implementations. Increasing global customer demand for miniaturized electronic products is a key driver in the design, development and wide application of high-density area array package format. Electronic components and their associated solder joints have reduced in size as the miniaturization trend in packaging continues to be challenged by printing through very small stencil apertures required for fine pitch flip-chip applications. At very narrow aperture sizes, solder paste rheology becomes crucial for consistent paste withdrawal. The deposition of consistent volume of solder from pad-to-pad is fundamental to minimizing surface mount assembly defects. This study investigates the relationship between volume of solder paste deposit (VSPD) and the volume of solder bump formed (VSBF) after reflow, and the effect of reflow profile parameters on lead-free solder bump formation and the associated solder joint integrity. The study uses a fractional factorial design (FFD) of 24−1 Ramp-Soak-Spike reflow profile, with all main effects and two-way interactions estimable to determine the optimal factorial combination. The results from the study show that the percentage change in the VSPD depends on the combination of the process parameters and reliability issues could become critical as the size of solder joints soldered on the same board assembly vary greatly. Mathematical models describe the relationships among VSPD, VSBF and theoretical volume of solder paste. Some factors have main effects across the volumes and a number of interactions exist among them. These results would be useful for R&D personnel in designing and implementing newer applications with finer-pitch interconnect.

Item Type: Conference Proceedings
Title of Proceedings: AIP Conference Proceedings
Additional Information: [1] Paper included in AIP Conference Proceedings, volume 1315, with subtitle International Conference on Advances in Materials and Processing Technologies(AMPT2010). AMPT 2010 took place 24-27 October 2010, in Paris, France. [2] Also allocated ISSN 0094-243X (print & online), 1551-7616 (online only).
Uncontrolled Keywords: reflow profile, lead-free soldering, solder joint integrity, flip chip, miniaturization
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering
Pre-2014 Departments: School of Engineering
School of Engineering > Manufacturing Engineering Research Group
School of Engineering > Department of Engineering Systems
Related URLs:
Last Modified: 14 Oct 2016 09:16
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
URI: http://gala.gre.ac.uk/id/eprint/6418

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