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Evaluating print performance of Sn-Ag-Cu leadfree solder pastes used in electronics assembly process

Evaluating print performance of Sn-Ag-Cu leadfree solder pastes used in electronics assembly process

Mallik, S., Bauer, R., Hübner, F. and Ekere, N.N. (2011) Evaluating print performance of Sn-Ag-Cu leadfree solder pastes used in electronics assembly process. In: International Conference on Advances in Materials and Processing Technologies (AMPT2010). AIP Conference Proceedings (1315/1). American Institute of Physics (AIP), Melville, NY, USA, pp. 33-38. ISBN 978-0-7354-0871-5 ISSN 0094-243X (doi:10.1063/1.3552465)

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Abstract

Solder paste is the most widely used interconnection material in the electronic assembly process for attaching electronic components/devices directly onto the surface of printed circuit boards, using stencil printing process. This paper evaluates the performance of three different commercially available Sn-Ag-Cu solder pastes formulated with different particle size distributions (PSD), metal content and alloy composition. A series of stencil printing tests were carried out using a specially designed stencil of 75 μm thickness and apertures of 300×300 μm2 dimension and 500 μm pitch sizes. Solder paste printing behaviors
were found related to attributes such as slumping and surface tension and printing performance was correlated with metal content and PSD. The results of the study should benefit paste manufacturers and SMT assemblers to improve their products and practices.

Item Type: Conference Proceedings
Title of Proceedings: International Conference on Advances in Materials and Processing Technologies (AMPT2010)
Additional Information: [1] Published in AIP Conference Proceedings, Volume 1315, Part One. [2] Paper presented at the International Conference on Advances in Materials and Processing Technologies (AMPT2010), held 24-27 October 2010, Paris, France.
Uncontrolled Keywords: integrated circuits, interconnected systems, soldering, surface tension, computer-aided design of microcircuits, layout and modeling, metallization, contacts, interconnects; device isolation, Workshop procedures, Surface tension and related phenomena
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering
Pre-2014 Departments: School of Engineering
Related URLs:
Last Modified: 14 Oct 2016 09:16
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
URI: http://gala.gre.ac.uk/id/eprint/6414

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