Flo/Stress: an integrated software module to predict stress in electronic products
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Bailey, C., Warner, M., Agha, A., Pericleous, K., Parry, J., Marooney, C., Reeves, H. and Clark, I. (2002) Flo/Stress: an integrated software module to predict stress in electronic products. Computing and Control Engineering Journal, 13 (3). pp. 143-148. ISSN 0956-3385
Full text not available from this repository.Official URL: http://dx.doi.org/10.1049/ccej:20020306
Abstract
Software technology that predicts stress in electronic systems and packages, developed as part of TCS Programme, is described. The software is closely integrated within a thermal design tool providing the ability to simulate the coupled effects of airflow, temperature and stress on product performance. This integrated approach to analysis will help decrease the number of design cycles.
| Item Type: | Article |
|---|---|
| Uncontrolled Keywords: | integrated software module, stress, electronic products |
| Subjects: | T Technology > TK Electrical engineering. Electronics Nuclear engineering |
| School / Department / Research Groups: | School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Science & Engineering Group School of Computing & Mathematical Sciences > Department of Computer Systems Technology School of Computing & Mathematical Sciences > Department of Mathematical Sciences |
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| Last Modified: | 09 Aug 2012 17:30 |
| URI: | http://gala.gre.ac.uk/id/eprint/545 |
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