Lifetime prediction of an IGBT power electronics module under cyclic temperature loading conditions
Lu, Hua and Bailey, C. (2009) Lifetime prediction of an IGBT power electronics module under cyclic temperature loading conditions. In: Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09. International Conference on. Institute of Electrical and Electronics Engineers, Piscataway, NJ USA, pp. 274-279. ISBN 9781424446582 (print), 9781424446599 (doi:10.1109/ICEPT.2009.5270749)Full text not available from this repository.
The lifetime of an IGBT power electronics module under
cyclic temperature loading conditions has been analyzed
using Finite Element Analysis method. The failure
mechanisms that have been taken into account are the fatigue
of the chip-mount-down solder joint, the substrate attach
solder joint, the busbar solder joint and the Aluminum
wirebond. The results show that the lifetime of the module is about 1000 cycles under the -40 to 125C cyclic temperature loading condition. The critical failure location has been found to be the busbar solder joint and the lack of compliance of the busbar design is the cause of the problem. The objective of this paper is to demonstrate the methodology of using physics of failure approach for the reliability analysis of power electronics modules and highlights the important design parameters that affect the thermal-mechanical fatigue failures of these components.
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