A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects
Kamara, E., Lu, H., Bailey, C., Hunt, C., Di Maio, D. and Thomas, O. (2010) A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. Microelectronics Reliability, 50 (9-11). pp. 1706-1710. ISSN 0026-2714 (doi:10.1016/j.microrel.2010.07.152)Full text not available from this repository.
Vibration loading can have a significant impact on the reliability of electronic components. Due to the cyclic strain and stress in the materials making up the component these can cause damage and hence wear out failures. The recent move from lead to lead-free soldering by the electronics industry has necessitated the generation of material properties data that will allow accurate prediction of the lead-free solder’s performance under vibration conditions. To assess the reliability of lead-free solders under vibration loading, test equipment has been designed for small solder joints. Such test equipment must be able to extract solder mechanical properties and physics of failure fatigue lifetime parameters/models for numerical model and prediction of lifetime of real electronic components. This paper focuses on the design, analysis and development of this type of test facility.
|Additional Information:|| First available online: 21 August 2010.  Published in print: September 2010.  Published as: Microelectronics Reliability, (2010), Vol. 50, (9–11), pp. 1706–1710 - in a special issue of Microelectronics Reliability, which contains the papers presented at the 21st European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis, (ESREF 2010), held 11-15 October 2010, in Montecassino Abbey and Gaeta, Italy.|
|Uncontrolled Keywords:||vibration, reliability,lead-free solders|
|Subjects:||Q Science > QA Mathematics > QA75 Electronic computers. Computer science
T Technology > TK Electrical engineering. Electronics Nuclear engineering
|Pre-2014 Departments:||School of Computing & Mathematical Sciences
School of Computing & Mathematical Sciences > Department of Computer Science
School of Computing & Mathematical Sciences > Department of Mathematical Sciences
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis
|Last Modified:||14 Oct 2016 09:11|
Actions (login required)