Co-design and multi-physics analysis for power electronic modules

Bailey, Christopher, Lu, Hua, Tilford, Tim, Rizvi, M.J. and Yin, Chunyan (2009) Co-design and multi-physics analysis for power electronic modules. In: 2009 10th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2009. IEEE Computer Society, Piscataway, NJ USA. ISBN 9781424441600

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Abstract

Power electronics uses semiconductor technology the
convert and transmit energy. Power electronics modules
such are the core electronic packages that underake this
function. The take up of these technologies is growing
dramatically due to the increase in electronics in sectors
such as automobiles, aerospace, consumer white goods,
and of course green technologies. Designing such
modules requires a multi-physics and multi-disciplinary
approach to accurately capture the influences of all the
constraints. These can include electro-magnetic, thermal,
and mechanical in terms of understanding radiation,
thermal management and reliability of the final package.
This paper will discuss some of the latest advances in
multi-physics & multi-disciplinary design for power
electronics models.

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