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Finite-element simulation of stress intensity factors in solder joint intermetallic compounds

Finite-element simulation of stress intensity factors in solder joint intermetallic compounds

Alam, M.O., Lu, Hua, Bailey, Chris and Chan, Y.C (2009) Finite-element simulation of stress intensity factors in solder joint intermetallic compounds. IEEE Transactions on Device and Materials Reliability, 9 (1). pp. 40-48. ISSN 1530-4388 (doi:10.1109/TDMR.2008.2010595)

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Abstract

The trend toward the miniaturization of electronic products leads to the need for very small sized solder joints, where the volume fraction of intermetallic compounds (IMCs) would be higher. In this paper, a fracture mechanics study of the IMC layer for SnPb and Pb-free solder joints has been carried out using a finite-element numerical computer modeling method. It is assumed that only one crack is present in the IMC layer. The linear elastic fracture mechanics approach is used for the parametric study of the stress intensity factors [(SIFs)KI andKII] at the predefined crack in the IMC layer of the solder-butt-joint tensile sample. Contrary to intuition, it is revealed that a thicker IMC layer, in fact, increases the reliability of a solder joint for a cracked IMC — assuming that there is only a single crack that exists in the IMC layer. Even if the whole solder layer is replaced by the IMC in the solder joint, the fracture propagation possibility is greatly reduced. Values of KI and KII are found to decrease with the location of the crack farther away from the solder interfaces while other parameters are constant. Temperature and strain rate are also found to have a significant influence on the SIF values. It has been found that a soft solder matrix generates a nonuniform plastic deformation across the solder–IMC interface near the crack tip that is responsible for obtaining awide range ofKI andKII values.

Item Type: Article
Additional Information: [1] Published online: 27 February 2009 [2] Issue published: March 2009. [3] Published as: IEEE Transactions on Device and Materials Reliability, (2009), Vol. 9, (1), pp. 40-48. [4] INSPEC Accession Number: 10501783.
Uncontrolled Keywords: failure analysis, finite element modeling, fracture mechanics, intermetallic compound, reliability, solder joint
Subjects: Q Science > QA Mathematics
Pre-2014 Departments: School of Computing & Mathematical Sciences
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis
School of Computing & Mathematical Sciences > Department of Computer Systems Technology
School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:
Last Modified: 14 Oct 2016 09:11
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
URI: http://gala.gre.ac.uk/id/eprint/4456

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