Modular microwave-based system for packaging applications
Adamietz, R., Tilford, T., Ferenets, M., Desmulliez, M.P.Y., Muller, G., Othman, N and Eicher, F. (2010) Modular microwave-based system for packaging applications. In: International Conference on Electronics Packaging (ICEP2010), 12-14 May 2010, Sapporo, Hokkaido, Japan. (Unpublished)Full text not available from this repository.
Current industrial processes for curing of thermosetting polymer materials utilized in electronics packaging aplications require the entire board assembly to be heated. An alternative approach, capable of curing individial packages on a board assembly, is described. The system consists of a small micro-engineered variable frequency microwave system which is capable of rapidly heating polymer materials. Whilst prototype systems have been shown to be able to cure packaging materials, it has not been possible to integrate the system into an industrial manufacturing line. This contribution focuses on the challenges encountered in the integration process and solutions adopted. The system implemented was based on a Sysmelec portal robot placement machine with additional tools to enable integrated pick, place and dispense capability. The completed system was demonstrated to be able to conduct fully automated pick - place - dispense - cure operations. Tests on curing encapsulant materials dispensed over a commercially available QFN were performed to determine post-process functionalty of the package, with no detrimental effects evident.
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