Skip navigation

Evaluation of polymer cure models in microelectronics packaging applications

Evaluation of polymer cure models in microelectronics packaging applications

Tilford, T., Ferenets, M., Morris, J., Rajaguru, P.R., Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. (2010) Evaluation of polymer cure models in microelectronics packaging applications. In: International Conference on Electronics Packaging (ICEP2010), 12-14 May 2010, Sapporo, Hokkaido, Japan. (Unpublished)

Full text not available from this repository.

Abstract

Packaging processes such as flip-chip underfill and encapsulation are critical to device reliability, with poor quality cure processes resulting in significant reliability problems. As in-situ analysis of material cure is highly complex, a number of numerical models have been developed to provide an estimate of cure. This work focuses on evaluating the accuracy of six models in determining the cure kinetics of commercially available polymer materials used by the microelectronics packaging industry. The cure processes of an encapsulant and an underfill material were analysed using Differential Scanning Calorimetry (DSC) equipment. The numerical models were fitted to the experimental data using a particle swarm optimisation method, enabling the ultimate accuracy of the models to be determined. Results obtained show that the single-step autocatalytic model would appear to provide a more accurate estimate of cure knetics process than either the nth order type or the more complex double step models. The overall accuracy of the model is quite high with close agreement between experimental and numerical results. Further studies are required to consider the multi-component nature of underfill and encapsulant materials.

Item Type: Conference or Conference Paper (Poster)
Additional Information: [1] This paper (TD3-4) was presented within the Poster Session, TD3:DMR5 Mechanical, on 13 May 2010 at The International Conference on Electronics Packaging (ICEP) 2010 held from 12-14 May 2010 at the Sapporo Convention Center in Sapporo, Hokkaido, Japan.
Uncontrolled Keywords: estimate of cure, cure kinetics, differential scanning calorimetry
Subjects: Q Science > QA Mathematics > QA75 Electronic computers. Computer science
Pre-2014 Departments: School of Computing & Mathematical Sciences
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis
Related URLs:
Last Modified: 14 Oct 2016 09:11
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
URI: http://gala.gre.ac.uk/id/eprint/4313

Actions (login required)

View Item View Item