On the integration of microwave curing systems into microelectronics assembly processes
Adamietz, R., Müller, G., Othman, N., Eicher, F., Tilford, T., Ferenets, M., Pavuluri, S.K., Desmulliez, M. P.Y. and Bailey, C. (2010) On the integration of microwave curing systems into microelectronics assembly processes. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:10.1109/ESTC.2010.5642827)Full text not available from this repository.
In microelectronics packaging applications a variety of thermosetting polymer materials is applied. Such materials are dispensed in a liquid form and are heated with the intent to cure them. Conventional processes often take several hours to bring the material up to temperatures which result in a significant rate of cure. An alternative approach to curing thermosetting polymers is the use of microwave energy, which has been shown to cure encapsulant materials in substantially shorter times. A recent innovation is the open-ended microwave oven proposed by Sinclair et al.. This paper deals with the implementation of the open-ended microwave oven into a precision placement machine. Two test products for encapsulation and flip-chip serve as objective for microwave-assisted assembly. An integrated system setup including the open ended oven is presented. Modifications on the open-ended microwave oven are described and a concept for the development of an embedded microwave curing system is presented. Tests on curing encapsulant materials dispensed over a commercially available QFN were performed to determine post-process functionality of the package, with no evident detrimental effects.
|Item Type:||Conference Proceedings|
|Title of Proceedings:||Electronics System Integration Technology Conference, ESTC 2010 - Proceedings|
|Additional Information:||This paper was published in the Proceedings of the Conference on Electronics System-Integration Technology, held 13-16 September 2010, Berlin, Germany.|
|Uncontrolled Keywords:||microwave energy, microwave curing system|
|Subjects:||T Technology > TK Electrical engineering. Electronics Nuclear engineering|
|School / Department / Research Groups:||School of Computing & Mathematical Sciences|
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis
School of Computing & Mathematical Sciences > Department of Mathematical Sciences
|Last Modified:||07 Mar 2012 11:59|
Actions (login required)