Skip navigation

On the integration of microwave curing systems into microelectronics assembly processes

On the integration of microwave curing systems into microelectronics assembly processes

Adamietz, R., Müller, G., Othman, N., Eicher, F., Tilford, T., Ferenets, M., Pavuluri, S.K., Desmulliez, M. P.Y. and Bailey, C. (2010) On the integration of microwave curing systems into microelectronics assembly processes. In: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. IEEE Computer Society, Piscataway, USA, pp. 1-6. ISBN 9781424485536 (Print), 9781424485543 (Online) (doi:10.1109/ESTC.2010.5642827)

Full text not available from this repository.

Abstract

In microelectronics packaging applications a variety of thermosetting polymer materials is applied. Such materials are dispensed in a liquid form and are heated with the intent to cure them. Conventional processes often take several hours to bring the material up to temperatures which result in a significant rate of cure. An alternative approach to curing thermosetting polymers is the use of microwave energy, which has been shown to cure encapsulant materials in substantially shorter times. A recent innovation is the open-ended microwave oven proposed by Sinclair et al.. This paper deals with the implementation of the open-ended microwave oven into a precision placement machine. Two test products for encapsulation and flip-chip serve as objective for microwave-assisted assembly. An integrated system setup including the open ended oven is presented. Modifications on the open-ended microwave oven are described and a concept for the development of an embedded microwave curing system is presented. Tests on curing encapsulant materials dispensed over a commercially available QFN were performed to determine post-process functionality of the package, with no evident detrimental effects.

Item Type: Conference Proceedings
Title of Proceedings: Electronics System Integration Technology Conference, ESTC 2010 - Proceedings
Additional Information: This paper was published in the Proceedings of the Conference on Electronics System-Integration Technology, held 13-16 September 2010, Berlin, Germany.
Uncontrolled Keywords: microwave energy, microwave curing system
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering
Pre-2014 Departments: School of Computing & Mathematical Sciences
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis
School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:
Last Modified: 14 Oct 2016 09:11
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
URI: http://gala.gre.ac.uk/id/eprint/4303

Actions (login required)

View Item View Item