Skip navigation

Empirical modeling of the time-dependent structural build-up of lead-free solder pastes used in the electronics assembly applications

Empirical modeling of the time-dependent structural build-up of lead-free solder pastes used in the electronics assembly applications

Mallik, S., Ekere, N.N. and Bhatti, R. (2010) Empirical modeling of the time-dependent structural build-up of lead-free solder pastes used in the electronics assembly applications. Journal of ASTM International, 7 (9). ISSN 1546-962X (doi:10.1520/JAI103043)

Full text not available from this repository.

Abstract

Solder paste is the primary bonding material used in the assembly of surface mount devices in electronics industries. It generally has a flocculated structure, which may break-down on shearing and slowly rebuild at rest. The proper characterization of the time-dependent rheological behaviors of solder pastes is crucial for establishing the relationships between the pastes’ structure and flow behavior and for correlating the physical parameters with paste printing performance. In this paper, we present a novel method that has been developed for characterizing the time-dependent and non-Newtonian rheological behavior of solder pastes and flux mediums as a function of shear rates. The objective of the study reported in this paper was to investigate the thixotropic build-up behavior of solder paste and flux mediums. The stretched exponential model has been used to model the structural changes during the build-up process and to correlate model parameters with the paste printing process. As expected, for solder paste samples, the rate of structural recovery was found dependent on the applied shear rate. The model parameters, such as equilibrium viscosity and characteristic time, have been correlated with the shear-thinning and slumping behaviors of solder paste during the stencil printing process.

Item Type: Article
Uncontrolled Keywords: solder pastes, lead-free, stretched exponential model, flux, rheology, time-dependent behaviors
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering
Pre-2014 Departments: School of Engineering
School of Engineering > Manufacturing Engineering Research Group
Related URLs:
Last Modified: 14 Oct 2016 09:10
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
URI: http://gala.gre.ac.uk/id/eprint/4115

Actions (login required)

View Item View Item