Multiphysics simulation of microwave curing of polymer materials in micro-electronics packaging applications
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Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing of polymer materials in micro-electronics packaging applications. In: Proceedings book 11th International Conference on Microwave and High Frequency Heating, Oradea, Romania, September, 3-6 2007. University of Oradea, Romania, Oradea, Romania, pp. 189-192. ISBN 9789737593337
Full text not available from this repository.| Item Type: | Book Section |
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| Additional Information: | This paper forms part of the published proceedings from the 11th International Conference on Microwave and High Frequency Heating, Oradea, Romania, September 3-6, 2007 |
| Uncontrolled Keywords: | multiphysics, microwave, curing, coupled simulation, CFD, FDTD |
| Subjects: | T Technology > T Technology (General) T Technology > TK Electrical engineering. Electronics Nuclear engineering |
| School / Department / Research Groups: | School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Department of Mathematical Sciences |
| Related URLs: | |
| Last Modified: | 08 Nov 2010 14:26 |
| URI: | http://gala.gre.ac.uk/id/eprint/3358 |
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