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Multiphysics simulation of microwave curing of polymer materials in micro-electronics packaging applications

Multiphysics simulation of microwave curing of polymer materials in micro-electronics packaging applications

Tilford, Tim, Sinclair, Keith I., Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2007) Multiphysics simulation of microwave curing of polymer materials in micro-electronics packaging applications. In: Silaghi, Alexandru Marius and Gordan, Ioan Mircea, (eds.) Proceedings book 11th International Conference on Microwave and High Frequency Heating, Oradea, Romania, September, 3-6 2007. University of Oradea, Romania, Oradea, Romania, pp. 189-192. ISBN 9789737593337

Full text not available from this repository.
Item Type: Book Section
Additional Information: This paper forms part of the published proceedings from the 11th International Conference on Microwave and High Frequency Heating, Oradea, Romania, September 3-6, 2007
Uncontrolled Keywords: multiphysics, microwave, curing, coupled simulation, CFD, FDTD
Subjects: T Technology > T Technology (General)
T Technology > TK Electrical engineering. Electronics Nuclear engineering
Pre-2014 Departments: School of Computing & Mathematical Sciences
School of Computing & Mathematical Sciences > Department of Mathematical Sciences
Related URLs:
Last Modified: 14 Oct 2016 09:08
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
URI: http://gala.gre.ac.uk/id/eprint/3358

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