Effect of temperature on slumping behaviour of lead-free solder paste and its rheological simulation
Marks, A.E., Mallik, S., Ekere, N.N. and Seman, A. (2008) Effect of temperature on slumping behaviour of lead-free solder paste and its rheological simulation. 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, New York, USA, pp. 829-832. ISBN 97814244-28137 (Print), 978-1-4244-2814-4 (Electronic) (doi:10.1109/ESTC.2008.4684459)Full text not available from this repository.
Variation in temperature can have a significant impact on the rheological characterisation of solder pastes used in the electronic assembly of surface mount devices. This paper concerns the study of the effect of temperature on slumping characteristics of lead-free solder pastes. The identification of the slumping characteristics can help in the correlation of the pastes characteristics to its printing performance. Further issues, which aid in justifying the undertaking of such a study, include the temperature differences identified both at the squeegee during the print, and during reflow. Due to these temperature variations, it is imperative to understand how slump differs with a temperature gradient
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