Effect of long-term aging on the rheological characteristics and printing performance of lead-free solder pastes used for flip-chip assembly
Ekere, Ndy, Marks, Antony, Mallik, Sabuj and Durairaj, Rajkumar (2008) Effect of long-term aging on the rheological characteristics and printing performance of lead-free solder pastes used for flip-chip assembly. Smart Processing Technology, 2. pp. 131-134.Full text not available from this repository.
Stencil printing of solder pastes is a critical stage in the SMT assembly process as a high proportion of the solder-related defects can be attributed to this stage. As the trend towards product miniaturization continues, there is a greater need for better understanding of the rheological behaviour and printing performance of new paste
formulations. This fundamental understanding is crucial for achieving the repeatable solder paste deposits from board-to-board and pad-to-pad required for more reliable solder interconnections. The paper concerns a study on the effect of ageing on the rheological characteristics and printing performance of new lead-free solder pastes formulations used for flip-chip assembly applications. The objective is to correlate the rheological characteristics of aged paste samples to their printing performance. The methodology developed can be used for bench-marking new lead-free paste formulations in terms of shelf life, the potential deterioration in rheological characteristics and their printing performance.
|Additional Information:||This book was published as the proceedings of the Second International Symposium on Smart Processing Technology (SPT '07), Nov. 27-28, 2007 Osaka Japan|
|Uncontrolled Keywords:||lead-free solder pastes, rheological characteristics, ageing, printing performance, flip-chip assembly,|
|Subjects:||T Technology > T Technology (General)|
T Technology > TK Electrical engineering. Electronics Nuclear engineering
Q Science > QA Mathematics > QA75 Electronic computers. Computer science
|School / Department / Research Groups:||School of Engineering|
School of Engineering > Department of Engineering Systems
School of Engineering > Electronics Manufacturing Engineering Research Group
|Last Modified:||21 Dec 2012 12:48|
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