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Effect of long-term aging on the rheological characteristics and printing performance of lead-free solder pastes used for flip-chip assembly

Effect of long-term aging on the rheological characteristics and printing performance of lead-free solder pastes used for flip-chip assembly

Ekere, Ndy, Marks, Antony, Mallik, Sabuj and Durairaj, Rajkumar (2008) Effect of long-term aging on the rheological characteristics and printing performance of lead-free solder pastes used for flip-chip assembly. Smart Processing Technology, 2. pp. 131-134.

Full text not available from this repository.

Abstract

Stencil printing of solder pastes is a critical stage in the SMT assembly process as a high proportion of the solder-related defects can be attributed to this stage. As the trend towards product miniaturization continues, there is a greater need for better understanding of the rheological behaviour and printing performance of new paste
formulations. This fundamental understanding is crucial for achieving the repeatable solder paste deposits from board-to-board and pad-to-pad required for more reliable solder interconnections. The paper concerns a study on the effect of ageing on the rheological characteristics and printing performance of new lead-free solder pastes formulations used for flip-chip assembly applications. The objective is to correlate the rheological characteristics of aged paste samples to their printing performance. The methodology developed can be used for bench-marking new lead-free paste formulations in terms of shelf life, the potential deterioration in rheological characteristics and their printing performance.

Item Type: Article
Additional Information: This book was published as the proceedings of the Second International Symposium on Smart Processing Technology (SPT '07), Nov. 27-28, 2007 Osaka Japan
Uncontrolled Keywords: lead-free solder pastes, rheological characteristics, ageing, printing performance, flip-chip assembly,
Subjects: T Technology > T Technology (General)
T Technology > TK Electrical engineering. Electronics Nuclear engineering
Q Science > QA Mathematics > QA75 Electronic computers. Computer science
Pre-2014 Departments: School of Engineering
School of Engineering > Department of Engineering Systems
School of Engineering > Manufacturing Engineering Research Group
Related URLs:
Last Modified: 14 Oct 2016 09:07
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
URI: http://gala.gre.ac.uk/id/eprint/2657

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