A methodology for characterising new lead-free solder paste formulations used for flip-chip assembly applications
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Ekere, Ndy and Mallik, Sabuj (2008) A methodology for characterising new lead-free solder paste formulations used for flip-chip assembly applications. In: Smart processing technology: SPT '07. High Temperature Society of Japan, Ibaraki, Japan, pp. 59-64.
Full text not available from this repository.Abstract
The paper reports on the investigation of the rheological behaviour new lead-free solder pastes formulations for use in flip-chip assembly applications. The study is made up of three parts; namely the evaluation of the effect of plate geometry, the effect of temperature and processing environment and the effect of torsional frequencies on the rheological measurements. Different plate geometries and rheological tests were used to evaluate new formulations in terms of wall slip characteristics, linear viscoelastic region and shear thinning behaviour. A technique which combines the use of the creep-recovery and dynamic frequency sweep tests was used to further characterise the paste structure, rheological behaviour and the processing performance of the new paste formulations. The technique demonstrated in this study has wide utility for R & D personnel involved in new paste formulation, for implementing quality control procedures used in paste manufacture and packaging and for qualifying new flip-chip assembly lines
| Item Type: | Book Section |
|---|---|
| Additional Information: | This paper was published in the proceedings of the Second International Symposium on Smart Processing Technology, held 27-28 Nov 2007, Osaka Japan. |
| Uncontrolled Keywords: | lead-free soldering, new solder paste formulation, flip chip assembly, ultra-fine pitch assembly, wall-slip, creep-recovery, rheological characterisation |
| Subjects: | T Technology > T Technology (General) T Technology > TK Electrical engineering. Electronics Nuclear engineering Q Science > QA Mathematics > QA75 Electronic computers. Computer science |
| School / Department / Research Groups: | School of Engineering School of Engineering > Electronics Manufacturing Engineering Research Group School of Engineering > Department of Engineering Systems |
| Related URLs: | |
| Last Modified: | 31 Mar 2011 18:21 |
| URI: | http://gala.gre.ac.uk/id/eprint/2656 |
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