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Modelling the time-dependent behaviour of solder pastes used in the electronics assembly applications

Modelling the time-dependent behaviour of solder pastes used in the electronics assembly applications

Mallik, Sabuj, Ekere, Ndy, Seman, Anton and Durairaj, Rajkumar (2009) Modelling the time-dependent behaviour of solder pastes used in the electronics assembly applications. In: 11th Electronic Material and Packaging Conference (EMAP 2009), 1-2 Dec 2009, Penang, Malaysia. (Unpublished)

Full text not available from this repository.

Abstract

Solder paste is the most widely used bonding
material in the assembly of surface mount devices in electronic industries. It generally has a flocculated structure (show aggregation of solder particles), and hence are known to exhibit a thixotropic behavior. This is recognized by the decrease in apparent viscosity of paste material with time when subjected to a constant shear rate. The proper characterisation of this timedependent
rheological behaviour of solder pastes is crucial for
establishing the relationships between the pastes’ structure and flow behaviour; and for correlating the physical parameters with paste printing performance. In this paper, we present a novel method which has been developed for characterising the timedependent
and non-Newtonian rheological behaviour of solder
pastes as a function of shear rates. The objective of the study reported in this paper is to investigate the thixotropic build-up behaviour of solder pastes. The stretched exponential model(SEM) has been used to model the structural changes during the build-up process and to correlate model parameters with the paste printing process.

Item Type: Conference or Conference Paper (Paper)
Additional Information: This paper was given at the 11th International Conference on Electronics Materials and Packaging held in Penang, Malaysia December 1-3 2009
Uncontrolled Keywords: rheology, solder paste, thixotropy , stretched exponential model
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering
Pre-2014 Departments: School of Engineering
School of Engineering > Department of Engineering Systems
School of Engineering > Manufacturing Engineering Research Group
Related URLs:
Last Modified: 14 Oct 2016 09:04
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
URI: http://gala.gre.ac.uk/id/eprint/1617

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