Investigation of wall-slip behaviour in lead-free solder pastes and isotropic conductive adhesives
Ekere, Ndy, Durairaj, Rajkumar, Mallik, Sabuj and Seman, Anton (2009) Investigation of wall-slip behaviour in lead-free solder pastes and isotropic conductive adhesives. Sadhana - Academy Proceedings in Engineering Sciences, 34 (5). pp. 1-12. ISSN 0256-2499 (Print) 0973-7677 (Online)Full text not available from this repository.
Slippage due to wall depletion effect is well-known in rheological investigation. The aim of this study was to investigate the influence of the paste microstructure on slip formation for the paste materials (lead-free solder paste and isotropic conductive adhesives). The effect of different flowgeometries, gap heights and surface roughness on the paste viscosity was investigated. The utilisation of different measuring geometries has not clearly showed the presence of wall-slip in the paste samples. The existence of wall-slip was found to be pronounced when gap heights were varied using the parallel plate geometry. It was also found that altering the surface roughness of the parallel plate measuring geometry did not significantly eliminate wall-slip as expected. But results indicate that the use of a relatively rough surface helps to increase paste adhesion to the plates and to a certain extent inducing structural breakdown in the paste. Most importantly, the study also demonstrated on how the wall-slip formation in the paste material could be utilised for understanding of the paste microstructure and its flow behaviour.
|Uncontrolled Keywords:||Wall-slip, solder paste, rheology, isotropic conductive adhesives, stencil printing process|
|Subjects:||T Technology > TK Electrical engineering. Electronics Nuclear engineering|
|School / Department / Research Groups:||School of Engineering|
School of Engineering > Department of Engineering Systems
School of Engineering > Electronics Manufacturing Engineering Research Group
|Last Modified:||06 Jul 2011 15:54|
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