Modeling the diffusion of solid copper into liquid solder alloys
Rizvi, M.J., Lu, Hua and Bailey, Christopher (2009) Modeling the diffusion of solid copper into liquid solder alloys. Thin Solid Films, 517 (5). pp. 1686-1689. ISSN 0040-6090 (doi:10.1016/j.tsf.2008.09.105)Full text not available from this repository.
During the soldering process, the copper atoms diffuse into liquid solders. The diffusion process determines integrity and the reworking possibility of a solder joint. In order to capture the diffusion scenarios of solid copper into liquid Sn–Pb and Sn–Cu solders, a computer modeling has been performed for 10 s. An analytical model has also been proposed for calculating the diffusion coefficient of copper into liquid solders. It is found that the diffusion coefficient for Sn–Pb solder is 2.74 × 10− 10 m2/s and for Sn–Cu solder is 6.44 × 10−9 m2/s. The modeling results reveal that the diffusion coefficient is one of the major factors that govern the rate at which solid Cu dissolve in the molten solder. The predicted dissolved amounts of copper into solders have been validated with the help of scanning electron microscopic analysis.
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