Computer simulation of aluminium wirebonds with globtop in power electronics modules
Lu, Hua, Loh, Wei-Sun, Bailey, Christopher and Johnson, C. Mark (2008) Computer simulation of aluminium wirebonds with globtop in power electronics modules. In: 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-351. ISBN 978-1-4244-3623-1Full text not available from this repository.
In this paper, computer modelling techniques are used to analyse the effects of globtops on the reliability of aluminium wirebonds in power electronics modules under cyclic thermal-mechanical loading conditions. The sensitivity of the wirehond reliability to the changes of the geometric and the material property parameters of wirebond globtop are evaluated and the optimal combination of the Young's modulus and the coefficient of thermal expansion have been predicted.
|Item Type:||Book Section|
|Additional Information:||This paper forms part of the Proceedings of the 3rd International Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008 (IMPACT 2008), held jointly with the 10th International Conference on Electronics Materials and Packaging (EMAP), on 22-24 October 2008 in Taipei, Taiwan. ©2008 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.|
|Uncontrolled Keywords:||power electronic modules (PEMs), globtop, reliability, computer modelling, aluminium, wirebond|
|Subjects:||T Technology > TK Electrical engineering. Electronics Nuclear engineering|
Q Science > QA Mathematics > QA75 Electronic computers. Computer science
|School / Department / Research Groups:||School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis|
School of Computing & Mathematical Sciences
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group
School of Computing & Mathematical Sciences > Department of Computer Systems Technology
School of Computing & Mathematical Sciences > Department of Mathematical Sciences
|Last Modified:||31 Mar 2011 18:20|
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