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Shear strength and fracture surface studies of ball grid array (BGA) flexible surface-mount electronics packaging under isothermal ageing

Shear strength and fracture surface studies of ball grid array (BGA) flexible surface-mount electronics packaging under isothermal ageing

Mallik, Sabuj and Mehdawi, Ahmed Z. El (2014) Shear strength and fracture surface studies of ball grid array (BGA) flexible surface-mount electronics packaging under isothermal ageing. In: Yang, Gi-Chul, Ao, Sio-Iong and Gelman, Len, (eds.) Transactions on Engineering Technologies. Special Volume of the World Congress on Engineering 2013. Springer Netherlands, pp. 31-41. ISBN 9789401788311 (doi:10.1007/978-94-017-8832-8_3)

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Abstract

Electronic systems are known to be affected by the environmental and mechanical conditions, such as humidity, temperature, thermal shocks and vibration. These adverse environmental operating conditions, with time, could degrade the mechanical efficiency of the system and might lead to catastrophic failures. The aim of this study is to investigate the mechanical integrity of lead-free ball grid array (BGA) solder joints subjected to isothermal ageing at 150 and 175 °C, for up to 1,000 h. Upon ageing at 150 °C the Sn-3.5Ag solder alloy initially age-softened for up to 200 h. This behaviour was linked to the coarsening of grains. When aged beyond 200 h the shear strength was found to increase up to 400 h. This age-hardening was correlated with precipitation of hard Ag3Sn particles in Sn matrix. Further ageing resulted in gradual decrease in shear strength. This can be explained as the combined effect of precipitation coarsening and growth of intermetallic layer. Samples aged at 175 °C showed a similar behaviour with a reduced initial age-softening period and higher shear force values. Investigation of the fracture surfaces under a Scanning Electron Microscope (SEM) revealed that higher ageing temperature would expose the solder joints to brittle failures.

Item Type: Book Section
Additional Information: [1] ISBN: 978-94-017-8831-1 (Print) 978-94-017-8832-8 (Online).
Uncontrolled Keywords: ball grid array, ductile and brittle fractures, isothermal ageing, lead free solder alloy, shear strength, solder joint
Subjects: T Technology > TA Engineering (General). Civil engineering (General)
Faculty / Department / Research Group: Faculty of Engineering & Science
Related URLs:
Last Modified: 14 Oct 2016 09:29
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
URI: http://gala.gre.ac.uk/id/eprint/12324

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