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Study of the thermal stress in a Pb-free half-bump solder joint under current stressing

Study of the thermal stress in a Pb-free half-bump solder joint under current stressing

Wu, B.Y., Chan, Y.C., Zhong, H.W., Alam, M.O. and Lai, J.K.L. (2007) Study of the thermal stress in a Pb-free half-bump solder joint under current stressing. Applied Physics Letters, 90 (23). ISSN 000-6951 (doi:10.1063/1.2747183)

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Abstract

The thermal stress in a Sn3.5Ag1Cu half-bump solder joint under a 3.82×108 A/m2 current stressing was analyzed using a coupled-field simulation. Substantial thermal stress accumulated around the Al-to-solder interface, especially in the Ni+(Ni,Cu)3Sn4 layer, where a maximal stress of 138 MPa was identified. The stress gradient in the Ni layer was about 1.67×1013 Pa/m, resulting in a stress migration force of 1.82×10-16 N, which is comparable to the electromigration force, 2.82×10-16 N. Dissolution of the Ni+(Ni,Cu)3Sn4 layer, void formation with cracks at the anode side, and extrusions at the cathode side were observed

Item Type: Article
Uncontrolled Keywords: metals, semimetals, and alloys, fatigue, corrosion fatigue, embrittlement, cracking, fracture, and failure, brittleness, fracture
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering
Q Science > QA Mathematics > QA75 Electronic computers. Computer science
Pre-2014 Departments: School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis
School of Computing & Mathematical Sciences
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group
Related URLs:
Last Modified: 14 Oct 2016 09:03
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
URI: http://gala.gre.ac.uk/id/eprint/1158

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