Application of modelling for predicting the behaviour of polymers and adhesives in microelectronic and photonic devices
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Bailey, Christopher, Rizvi, M.J., Yin, Chunyan, Lu, Hua and Stoyanov, Stoyan (2007) Application of modelling for predicting the behaviour of polymers and adhesives in microelectronic and photonic devices. In: 6th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 240-244. ISBN 9781424411863
Full text not available from this repository.Abstract
With the growth in computing power, and advances in numerical methods for the solution of partial differential equations, modeling technologies based around computational fluid dynamics, finite element analysis and optimisation are now being widely used by researchers and industry. Polymer and adhesive materials are now being widely used in electronic and photonic devices. This paper will illustrate the use of modeling tools to predict the behaviour of these materials from product assembly to its performance and reliability.
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