Reliability analysis of SiP structures
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Bailey, Christopher, Stoyanov, Stoyan, Strusevitch, Nadia and Yannou, J.-M. (2007) Reliability analysis of SiP structures. In: HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration. Institute of Electrical and Electronics Engineers, Inc., New York, p. 38. ISBN 9781424412525
Full text not available from this repository.Abstract
This presentation discusses latest developments in SiP technology and the challenges for design in terms of manufacture and reliability. It presents results from a UK government funded project that aims to develop modelling techniques that will assess the thermo-mechanical reliability of SiP structures such as (i) stacked die, (ii) side-by-side dies and (iii) embedded die. Finite element analysis coupled with numerical optimisation and uncertainty analysis is used is used to model the reliability of a particular package design. In particular, the damage (energy density) in the lead free solder interconnects under accelerated temperature cycling is predicted and used to observe the fatigue life-time. Warpage of the structure is also investigated
| Item Type: | Book Section |
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| Additional Information: | This paper forms part of the published proceedings from International Symposium on High Density Packaging and Microsystems Integration Shanghai, Peoples R China, Jun 26-28, 2007 [2] This paper was also given at IMAPS POLAND 2007 31st International IMAPS Poland Conference & Exhibition, Rzeszów-Krasiczyn, 23-26 September 2007 - record 1153 in the repository |
| Uncontrolled Keywords: | SiP technology, thermo-mechanical reliability analysis, stacked die, side-by-side dies, embedded die, finite element analysis, numerical optimisation, uncertainty analysis, lead free solder interconnects, accelerated temperature cycle, fatigue life-time, warpage |
| Subjects: | T Technology > TK Electrical engineering. Electronics Nuclear engineering Q Science > QA Mathematics |
| School / Department / Research Groups: | School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group School of Computing & Mathematical Sciences > Department of Computer Systems Technology School of Computing & Mathematical Sciences > Department of Mathematical Sciences |
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| Last Modified: | 31 Mar 2011 18:20 |
| URI: | http://gala.gre.ac.uk/id/eprint/1152 |
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