Analysis of the thermo mechanical effects on packaging process of performance enhanced AMLCD's and the optical performance of the display
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Lee, Yek, Bailey, Christopher, Lu, Hua, Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Analysis of the thermo mechanical effects on packaging process of performance enhanced AMLCD's and the optical performance of the display. In: Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE , pp. 1214-1217. ISBN 9781424405527
Full text not available from this repository.Official URL: http://dx.doi.org/10.1109/ESTC.2006.280164
Abstract
The performance enhancement of AMLCD's has been hindered with problems encountered during the curing process, such as window framing and de-lamination of the glass and adhesive. A thermo-mechanical analysis using FEA was conducted to help optimise the design of the rugged display and enhance the optical performance.
| Item Type: | Book Section |
|---|---|
| Additional Information: | Originally presented as paper at 2006 1st Electronic Systemintegration Technology Conference 5-7 Sept, 2006, Dresden, Germany. |
| Uncontrolled Keywords: | AMLCD, thermo-mechanics, optical performance |
| Subjects: | T Technology > TK Electrical engineering. Electronics Nuclear engineering Q Science > QA Mathematics > QA75 Electronic computers. Computer science |
| School / Department / Research Groups: | School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis School of Computing & Mathematical Sciences School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group School of Computing & Mathematical Sciences > Department of Mathematical Sciences School of Computing & Mathematical Sciences > Department of Computer Science |
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| Last Modified: | 31 Mar 2011 18:20 |
| URI: | http://gala.gre.ac.uk/id/eprint/1045 |
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