Effects of thermal cycling profiles on the performance of chip-on-flex assembly using anisotropic conductive films
Rizvi, M.J., Bailey, Christopher, Chan, Y.C. and Lu, Hua (2006) Effects of thermal cycling profiles on the performance of chip-on-flex assembly using anisotropic conductive films. Thermal and Thermomechanical Phenomena in Electronics Systems, 2006. ITHERM '06. The Tenth Intersociety Conference on. IEEE, pp. 855-860. ISBN 0780395247 (doi:10.1109/ITHERM.2006.1645436)Full text not available from this repository.
Anisotropic conductive films (ACFs) are widely used in the electronic packaging industries because of their fine pitch potential and the assembly process is simpler compared to the soldering process. However, there are still unsolved issues in the volume productions using ACFs. The main reason is that the effects of many factors on the interconnects are not well understood. This work focuses on the performance of ACF-bonded chip-on-flex assemblies subjected to a range of thermal cycling test conditions. Both experimental and three-dimensional finite element computer modelling methods are used. It has been revealed that greater temperature ranges and longer dwell-times give rise to higher stresses in the ACF interconnects. Higher stresses are concentrated along the edges of the chip-ACF interfaces. In the experiments, the results show that higher temperature ranges and prolonged dwell times increase contact resistance values. Close examination of the microstructures along the bond-line through the scanning electron microscope (SEM) indicates that cyclic thermal loads disjoint the conductive particles from the bump of the chip and/or pad of the substrate and this is thought to be related to the increase of the contact resistance value and the failure of the ACF joints.
|Item Type:||Book Section|
|Additional Information:||Presented at 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems (ITHERM '06). San Diego, CA, May 30-Jun 02, 2006.|
|Uncontrolled Keywords:||chip-on-flex (COF), anisotropic conductive film (ACF), finite element modelling, stress, conductive particle, contact resistance, life-time|
|Subjects:||T Technology > TK Electrical engineering. Electronics Nuclear engineering
Q Science > QA Mathematics
|Pre-2014 Departments:||School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis
School of Computing & Mathematical Sciences
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group
School of Computing & Mathematical Sciences > Department of Computer Systems Technology
School of Computing & Mathematical Sciences > Department of Mathematical Sciences
School of Computing & Mathematical Sciences > Department of Computer Science
|Last Modified:||14 Oct 2016 09:02|
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