Thermo-mechanical modelling of power electronics module structures
Tilford, Tim, Lu, Hua and Bailey, Christopher (2006) Thermo-mechanical modelling of power electronics module structures. 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore. IEEE, Picsataway, N.J., pp. 214-219. ISBN 1424406641 (doi:10.1109/EPTC.2006.342718)Full text not available from this repository.
Power electronic modules distinguish themselves from other modules by their high power operation. These modules are used extensively in high power application markets such as aerospace, automotive, industrial and traction and drives. This paper discusses typical packaging technologies for power electronics modules. It also discusses the latest results from a UK research project investigating the physics-of-failure approach to reliability analysis and predictions for power modules. An integrated design enviroment for incorporating of affects of uncertainty into the design environment was outlined.
|Item Type:||Book Section|
|Additional Information:||Presented at 2006 8th Electronics Packaging Technology Conference (EPTC 2006) : 6-8 December 2006, Singapore|
|Uncontrolled Keywords:||power electronic modules, packaging technology, reliability prediction|
|Subjects:||T Technology > TK Electrical engineering. Electronics Nuclear engineering|
Q Science > QA Mathematics
|School / Department / Research Groups:||School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis|
School of Computing & Mathematical Sciences
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group
School of Computing & Mathematical Sciences > Department of Computer Systems Technology
School of Computing & Mathematical Sciences > Department of Mathematical Sciences
|Last Modified:||31 Mar 2011 18:20|
Actions (login required)