Assessing the performance of crack detection tests for solder joints
Ridout, Stephen, Dusek, Milos, Bailey, Christopher and Hunt, Chris (2006) Assessing the performance of crack detection tests for solder joints. Microelectronics Reliability, 46 (12). pp. 2122-2130. ISSN 0026-2714 (doi:10.1016/j.microrel.2006.05.001)Full text not available from this repository.
This paper presents both modelling and experimental test data to characterise the performance of four non-destructive tests. The focus is on determining the presence and rough magnitude of thermal fatigue cracks within the solder joints for a surface mount resistor on a strip of FR4 PCB. The tests all operate by applying mechanical loads to the PCB and monitoring the strain response at the top of the resistor. The modelling results show that of the four tests investigated, three are sensitive to the presence of a crack in the joint and its magnitude. Hence these tests show promise in being able to detect cracking caused by accelerated testing. The experimental data supports these results although more validation is required.
|Uncontrolled Keywords:||computer modelling, solder joints|
|Subjects:||Q Science > QA Mathematics|
|School / Department / Research Groups:||School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis|
School of Computing & Mathematical Sciences
School of Computing & Mathematical Sciences > Centre for Numerical Modelling & Process Analysis > Computational Mechanics & Reliability Group
School of Computing & Mathematical Sciences > Department of Computer Systems Technology
|Last Modified:||31 Mar 2011 18:20|
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