Durairaj, R., Mallik, S., Seman, A. and Ekere, N.N. (2009) Investigation of wall-slip behaviour in lead-free solder pastes and isotropic conductive adhesives. Sadhana - Academy Proceedings in Engineering Sciences, 34 (5). pp. 799-810. ISSN 0256-2499 (Print), 0973-7677 (Online) (doi:https://doi.org/10.1007/s12046-009-0046-5)

Narahari, Y., Raju, C. V. L., Ravikumar, K. and Shah, Sourabh (2005) Dynamic pricing models for electronic business. Sadhana - Academy Proceedings in Engineering Sciences, 30 (2 & 3). pp. 231-256. ISSN 0256-2499 (Print), 0973-7677 (Online)