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ACF ageing chip computer modelling contact resistance failure heat sink micro-contact micro-gap thermal constriction
Number of items: 10.

ACF

Rizvi, M.J., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2008) Failure mechanisms of ACF joints under isothermal ageing. Microelectronics Journal, 39 (9). pp. 1101-1107. ISSN 0026-2692 (doi:10.1016/j.mejo.2008.01.045)

ageing

Rizvi, M.J., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2008) Failure mechanisms of ACF joints under isothermal ageing. Microelectronics Journal, 39 (9). pp. 1101-1107. ISSN 0026-2692 (doi:10.1016/j.mejo.2008.01.045)

chip

Ekpu, Mathias, Bhatti, Raj, Okereke, M.I. ORCID logoORCID: https://orcid.org/0000-0002-2104-012X, Mallik, Sabuj and Otiaba, Kenny (2014) The effect of thermal constriction on heat management in a microelectronic application. Microelectronics Journal, 45 (2). 159 - 166. ISSN 0026-2692 (doi:10.1016/j.mejo.2013.10.011)

computer modelling

Rizvi, M.J., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2008) Failure mechanisms of ACF joints under isothermal ageing. Microelectronics Journal, 39 (9). pp. 1101-1107. ISSN 0026-2692 (doi:10.1016/j.mejo.2008.01.045)

contact resistance

Rizvi, M.J., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2008) Failure mechanisms of ACF joints under isothermal ageing. Microelectronics Journal, 39 (9). pp. 1101-1107. ISSN 0026-2692 (doi:10.1016/j.mejo.2008.01.045)

failure

Rizvi, M.J., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2008) Failure mechanisms of ACF joints under isothermal ageing. Microelectronics Journal, 39 (9). pp. 1101-1107. ISSN 0026-2692 (doi:10.1016/j.mejo.2008.01.045)

heat sink

Ekpu, Mathias, Bhatti, Raj, Okereke, M.I. ORCID logoORCID: https://orcid.org/0000-0002-2104-012X, Mallik, Sabuj and Otiaba, Kenny (2014) The effect of thermal constriction on heat management in a microelectronic application. Microelectronics Journal, 45 (2). 159 - 166. ISSN 0026-2692 (doi:10.1016/j.mejo.2013.10.011)

micro-contact

Ekpu, Mathias, Bhatti, Raj, Okereke, M.I. ORCID logoORCID: https://orcid.org/0000-0002-2104-012X, Mallik, Sabuj and Otiaba, Kenny (2014) The effect of thermal constriction on heat management in a microelectronic application. Microelectronics Journal, 45 (2). 159 - 166. ISSN 0026-2692 (doi:10.1016/j.mejo.2013.10.011)

micro-gap

Ekpu, Mathias, Bhatti, Raj, Okereke, M.I. ORCID logoORCID: https://orcid.org/0000-0002-2104-012X, Mallik, Sabuj and Otiaba, Kenny (2014) The effect of thermal constriction on heat management in a microelectronic application. Microelectronics Journal, 45 (2). 159 - 166. ISSN 0026-2692 (doi:10.1016/j.mejo.2013.10.011)

thermal constriction

Ekpu, Mathias, Bhatti, Raj, Okereke, M.I. ORCID logoORCID: https://orcid.org/0000-0002-2104-012X, Mallik, Sabuj and Otiaba, Kenny (2014) The effect of thermal constriction on heat management in a microelectronic application. Microelectronics Journal, 45 (2). 159 - 166. ISSN 0026-2692 (doi:10.1016/j.mejo.2013.10.011)

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