Browse by Journal Title
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ACF
Rizvi, M.J., Bailey, Christopher
ORCID: 0000-0002-9438-3879
and Lu, Hua
ORCID: 0000-0002-4392-6562
(2008)
Failure mechanisms of ACF joints under isothermal ageing.
Microelectronics Journal, 39 (9).
pp. 1101-1107.
ISSN 0026-2692
(doi:https://doi.org/10.1016/j.mejo.2008.01.045)
ageing
Rizvi, M.J., Bailey, Christopher
ORCID: 0000-0002-9438-3879
and Lu, Hua
ORCID: 0000-0002-4392-6562
(2008)
Failure mechanisms of ACF joints under isothermal ageing.
Microelectronics Journal, 39 (9).
pp. 1101-1107.
ISSN 0026-2692
(doi:https://doi.org/10.1016/j.mejo.2008.01.045)
chip
Ekpu, Mathias, Bhatti, Raj, Okereke, M.I.
ORCID: 0000-0002-2104-012X
, Mallik, Sabuj and Otiaba, Kenny
(2014)
The effect of thermal constriction on heat management in a microelectronic application.
Microelectronics Journal, 45 (2).
159 - 166.
ISSN 0026-2692
(doi:https://doi.org/10.1016/j.mejo.2013.10.011)
computer modelling
Rizvi, M.J., Bailey, Christopher
ORCID: 0000-0002-9438-3879
and Lu, Hua
ORCID: 0000-0002-4392-6562
(2008)
Failure mechanisms of ACF joints under isothermal ageing.
Microelectronics Journal, 39 (9).
pp. 1101-1107.
ISSN 0026-2692
(doi:https://doi.org/10.1016/j.mejo.2008.01.045)
contact resistance
Rizvi, M.J., Bailey, Christopher
ORCID: 0000-0002-9438-3879
and Lu, Hua
ORCID: 0000-0002-4392-6562
(2008)
Failure mechanisms of ACF joints under isothermal ageing.
Microelectronics Journal, 39 (9).
pp. 1101-1107.
ISSN 0026-2692
(doi:https://doi.org/10.1016/j.mejo.2008.01.045)
failure
Rizvi, M.J., Bailey, Christopher
ORCID: 0000-0002-9438-3879
and Lu, Hua
ORCID: 0000-0002-4392-6562
(2008)
Failure mechanisms of ACF joints under isothermal ageing.
Microelectronics Journal, 39 (9).
pp. 1101-1107.
ISSN 0026-2692
(doi:https://doi.org/10.1016/j.mejo.2008.01.045)
heat sink
Ekpu, Mathias, Bhatti, Raj, Okereke, M.I.
ORCID: 0000-0002-2104-012X
, Mallik, Sabuj and Otiaba, Kenny
(2014)
The effect of thermal constriction on heat management in a microelectronic application.
Microelectronics Journal, 45 (2).
159 - 166.
ISSN 0026-2692
(doi:https://doi.org/10.1016/j.mejo.2013.10.011)
micro-contact
Ekpu, Mathias, Bhatti, Raj, Okereke, M.I.
ORCID: 0000-0002-2104-012X
, Mallik, Sabuj and Otiaba, Kenny
(2014)
The effect of thermal constriction on heat management in a microelectronic application.
Microelectronics Journal, 45 (2).
159 - 166.
ISSN 0026-2692
(doi:https://doi.org/10.1016/j.mejo.2013.10.011)
micro-gap
Ekpu, Mathias, Bhatti, Raj, Okereke, M.I.
ORCID: 0000-0002-2104-012X
, Mallik, Sabuj and Otiaba, Kenny
(2014)
The effect of thermal constriction on heat management in a microelectronic application.
Microelectronics Journal, 45 (2).
159 - 166.
ISSN 0026-2692
(doi:https://doi.org/10.1016/j.mejo.2013.10.011)
thermal constriction
Ekpu, Mathias, Bhatti, Raj, Okereke, M.I.
ORCID: 0000-0002-2104-012X
, Mallik, Sabuj and Otiaba, Kenny
(2014)
The effect of thermal constriction on heat management in a microelectronic application.
Microelectronics Journal, 45 (2).
159 - 166.
ISSN 0026-2692
(doi:https://doi.org/10.1016/j.mejo.2013.10.011)