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Kumar, Santosh, Mallik, Sabuj, Ekere, Ndy and Jung, Jaepil (2013) Stencil Printing Behavior of Lead-Free Sn-3Ag-0.5Cu Solder Paste for Wafer Level Bumping for Sub-100 μm Size Solder Bumps. Metals and Materials International, 19 (5). pp. 1083-1090. ISSN 1598-9623 (Print), 2005-4149 (Online) (doi:https://doi.org/10.1007/s12540-013-5025-z)