Browse by Journal Title
Acoustic pressure
Tzanakis, I., Lebon, Gerard S. B., Eskin, D. G. and Pericleous, Kyriacos A. ORCID: https://orcid.org/0000-0002-7426-9999 (2016) Characterisation of the ultrasonic acoustic spectrum and pressure field in aluminium melt with an advanced cavitometer. Journal of Materials Processing Technology, 229. pp. 582-586. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2015.10.009)
Activity model
Ciurana, J., Ferrer, I. and Gao, J. X. ORCID: https://orcid.org/0000-0001-5625-3654 (2006) Activity model and computer aided system for defining sheet metal process planning. Journal of Materials Processing Technology, 173 (2). pp. 213-222. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2005.11.031)
aluminum alloy
Subroto, Tungky, Lebon, Gerard S. B., Eskin, Dmitry G., Skalicky, Ivan, Roberts, Dan, Tzanakis, Iakovos and Pericleous, Koulis ORCID: https://orcid.org/0000-0002-7426-9999 (2021) Numerical modelling and experimental validation of the effect of ultrasonic melt treatment in a direct-chill cast AA6008 alloy billet. Journal of Materials Processing Technology, 12. pp. 1582-1596. ISSN 0924-0136 (doi:10.1016/j.jmrt.2021.03.061)
Cavitation bubbles
Tzanakis, I., Lebon, Gerard S. B., Eskin, D. G. and Pericleous, Kyriacos A. ORCID: https://orcid.org/0000-0002-7426-9999 (2016) Characterisation of the ultrasonic acoustic spectrum and pressure field in aluminium melt with an advanced cavitometer. Journal of Materials Processing Technology, 229. pp. 582-586. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2015.10.009)
Cavitometer
Tzanakis, I., Lebon, Gerard S. B., Eskin, D. G. and Pericleous, Kyriacos A. ORCID: https://orcid.org/0000-0002-7426-9999 (2016) Characterisation of the ultrasonic acoustic spectrum and pressure field in aluminium melt with an advanced cavitometer. Journal of Materials Processing Technology, 229. pp. 582-586. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2015.10.009)
composite materials manufacturing
Li, Nanya, Li, Yingguang, Hang, Xiang and Gao, James ORCID: https://orcid.org/0000-0001-5625-3654 (2014) Analysis and optimization of temperature distribution in carbon fiber reinforced composite materials during microwave curing process. Journal of Materials Processing Technology, 214 (3). pp. 544-550. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2013.10.012)
Computer aided process planning
Ciurana, J., Ferrer, I. and Gao, J. X. ORCID: https://orcid.org/0000-0001-5625-3654 (2006) Activity model and computer aided system for defining sheet metal process planning. Journal of Materials Processing Technology, 173 (2). pp. 213-222. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2005.11.031)
Decision support system
Ciurana, J., Ferrer, I. and Gao, J. X. ORCID: https://orcid.org/0000-0001-5625-3654 (2006) Activity model and computer aided system for defining sheet metal process planning. Journal of Materials Processing Technology, 173 (2). pp. 213-222. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2005.11.031)
direct-chill (DC) casting
Subroto, Tungky, Lebon, Gerard S. B., Eskin, Dmitry G., Skalicky, Ivan, Roberts, Dan, Tzanakis, Iakovos and Pericleous, Koulis ORCID: https://orcid.org/0000-0002-7426-9999 (2021) Numerical modelling and experimental validation of the effect of ultrasonic melt treatment in a direct-chill cast AA6008 alloy billet. Journal of Materials Processing Technology, 12. pp. 1582-1596. ISSN 0924-0136 (doi:10.1016/j.jmrt.2021.03.061)
Drawing processes
Ciurana, J., Ferrer, I. and Gao, J. X. ORCID: https://orcid.org/0000-0001-5625-3654 (2006) Activity model and computer aided system for defining sheet metal process planning. Journal of Materials Processing Technology, 173 (2). pp. 213-222. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2005.11.031)
extrusion
Williams, A.J., Croft, T.N. and Cross, M. (2002) Computational modelling of metal extrusion and forging processes. Journal of Materials Processing Technology, 125-6. pp. 573-582. ISSN 0924-0136 (doi:10.1016/S0924-0136(02)00401-6)
fatigue failures
Amalu, Emeka H. and Ekere, Ndy N. (2011) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2011.10.011)
finite volume
Williams, A.J., Croft, T.N. and Cross, M. (2002) Computational modelling of metal extrusion and forging processes. Journal of Materials Processing Technology, 125-6. pp. 573-582. ISSN 0924-0136 (doi:10.1016/S0924-0136(02)00401-6)
flip chip
Amalu, Emeka H. and Ekere, Ndy N. (2011) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2011.10.011)
flip-chip
Durairaj, R., Mallik, S., Seman, A., Marks, A. and Ekere, N.N. (2009) Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly. Journal of Materials Processing Technology, 209 (8). pp. 3923-3930. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2008.09.013)
forging
Williams, A.J., Croft, T.N. and Cross, M. (2002) Computational modelling of metal extrusion and forging processes. Journal of Materials Processing Technology, 125-6. pp. 573-582. ISSN 0924-0136 (doi:10.1016/S0924-0136(02)00401-6)
Frequency spectrum
Tzanakis, I., Lebon, Gerard S. B., Eskin, D. G. and Pericleous, Kyriacos A. ORCID: https://orcid.org/0000-0002-7426-9999 (2016) Characterisation of the ultrasonic acoustic spectrum and pressure field in aluminium melt with an advanced cavitometer. Journal of Materials Processing Technology, 229. pp. 582-586. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2015.10.009)
high temperature electronics
Amalu, Emeka H. and Ekere, Ndy N. (2011) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2011.10.011)
intermetallic compound
Amalu, Emeka H. and Ekere, Ndy N. (2011) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2011.10.011)
isotropic conductive adhesives
Durairaj, R., Mallik, S., Seman, A., Marks, A. and Ekere, N.N. (2009) Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly. Journal of Materials Processing Technology, 209 (8). pp. 3923-3930. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2008.09.013)
lead-free
Durairaj, R., Mallik, S., Seman, A., Marks, A. and Ekere, N.N. (2009) Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly. Journal of Materials Processing Technology, 209 (8). pp. 3923-3930. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2008.09.013)
linear visco-elastic
Durairaj, R., Mallik, S., Seman, A., Marks, A. and Ekere, N.N. (2009) Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly. Journal of Materials Processing Technology, 209 (8). pp. 3923-3930. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2008.09.013)
Liquid aluminium
Tzanakis, I., Lebon, Gerard S. B., Eskin, D. G. and Pericleous, Kyriacos A. ORCID: https://orcid.org/0000-0002-7426-9999 (2016) Characterisation of the ultrasonic acoustic spectrum and pressure field in aluminium melt with an advanced cavitometer. Journal of Materials Processing Technology, 229. pp. 582-586. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2015.10.009)
microelectronics reliability
Amalu, Emeka H. and Ekere, Ndy N. (2011) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2011.10.011)
microwave curing
Li, Nanya, Li, Yingguang, Hang, Xiang and Gao, James ORCID: https://orcid.org/0000-0001-5625-3654 (2014) Analysis and optimization of temperature distribution in carbon fiber reinforced composite materials during microwave curing process. Journal of Materials Processing Technology, 214 (3). pp. 544-550. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2013.10.012)
numerical modeling
Subroto, Tungky, Lebon, Gerard S. B., Eskin, Dmitry G., Skalicky, Ivan, Roberts, Dan, Tzanakis, Iakovos and Pericleous, Koulis ORCID: https://orcid.org/0000-0002-7426-9999 (2021) Numerical modelling and experimental validation of the effect of ultrasonic melt treatment in a direct-chill cast AA6008 alloy billet. Journal of Materials Processing Technology, 12. pp. 1582-1596. ISSN 0924-0136 (doi:10.1016/j.jmrt.2021.03.061)
optimization
Li, Nanya, Li, Yingguang, Hang, Xiang and Gao, James ORCID: https://orcid.org/0000-0001-5625-3654 (2014) Analysis and optimization of temperature distribution in carbon fiber reinforced composite materials during microwave curing process. Journal of Materials Processing Technology, 214 (3). pp. 544-550. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2013.10.012)
Pb-free solder
Amalu, Emeka H. and Ekere, Ndy N. (2011) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2011.10.011)
power electronics
Amalu, Emeka H. and Ekere, Ndy N. (2011) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2011.10.011)
rheology
Durairaj, R., Mallik, S., Seman, A., Marks, A. and Ekere, N.N. (2009) Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly. Journal of Materials Processing Technology, 209 (8). pp. 3923-3930. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2008.09.013)
Sheet metal processes
Ciurana, J., Ferrer, I. and Gao, J. X. ORCID: https://orcid.org/0000-0001-5625-3654 (2006) Activity model and computer aided system for defining sheet metal process planning. Journal of Materials Processing Technology, 173 (2). pp. 213-222. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2005.11.031)
solder joint
Amalu, Emeka H. and Ekere, Ndy N. (2011) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2011.10.011)
solder paste
Durairaj, R., Mallik, S., Seman, A., Marks, A. and Ekere, N.N. (2009) Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly. Journal of Materials Processing Technology, 209 (8). pp. 3923-3930. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2008.09.013)
temperature distribution
Li, Nanya, Li, Yingguang, Hang, Xiang and Gao, James ORCID: https://orcid.org/0000-0001-5625-3654 (2014) Analysis and optimization of temperature distribution in carbon fiber reinforced composite materials during microwave curing process. Journal of Materials Processing Technology, 214 (3). pp. 544-550. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2013.10.012)
temperature measurement
Subroto, Tungky, Lebon, Gerard S. B., Eskin, Dmitry G., Skalicky, Ivan, Roberts, Dan, Tzanakis, Iakovos and Pericleous, Koulis ORCID: https://orcid.org/0000-0002-7426-9999 (2021) Numerical modelling and experimental validation of the effect of ultrasonic melt treatment in a direct-chill cast AA6008 alloy billet. Journal of Materials Processing Technology, 12. pp. 1582-1596. ISSN 0924-0136 (doi:10.1016/j.jmrt.2021.03.061)
Ultrasonic melt treatment
Subroto, Tungky, Lebon, Gerard S. B., Eskin, Dmitry G., Skalicky, Ivan, Roberts, Dan, Tzanakis, Iakovos and Pericleous, Koulis ORCID: https://orcid.org/0000-0002-7426-9999 (2021) Numerical modelling and experimental validation of the effect of ultrasonic melt treatment in a direct-chill cast AA6008 alloy billet. Journal of Materials Processing Technology, 12. pp. 1582-1596. ISSN 0924-0136 (doi:10.1016/j.jmrt.2021.03.061)
Ultrasound
Tzanakis, I., Lebon, Gerard S. B., Eskin, D. G. and Pericleous, Kyriacos A. ORCID: https://orcid.org/0000-0002-7426-9999 (2016) Characterisation of the ultrasonic acoustic spectrum and pressure field in aluminium melt with an advanced cavitometer. Journal of Materials Processing Technology, 229. pp. 582-586. ISSN 0924-0136 (doi:10.1016/j.jmatprotec.2015.10.009)