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Group by: Creators | Item Type | Uncontrolled Keywords | No Grouping
Acoustic pressure Activity model aluminum alloy Cavitation bubbles Cavitometer composite materials manufacturing Computer aided process planning Decision support system direct-chill (DC) casting Drawing processes extrusion fatigue failures finite volume flip chip flip-chip forging Frequency spectrum high temperature electronics intermetallic compound isotropic conductive adhesives lead-free linear visco-elastic Liquid aluminium microelectronics reliability microwave curing numerical modeling optimization Pb-free solder power electronics rheology Sheet metal processes solder joint solder paste temperature distribution temperature measurement Ultrasonic melt treatment Ultrasound
Number of items: 37.

Acoustic pressure

Tzanakis, I., Lebon, Gerard S. B., Eskin, D. G. and Pericleous, Kyriacos A. ORCID: 0000-0002-7426-9999 (2016) Characterisation of the ultrasonic acoustic spectrum and pressure field in aluminium melt with an advanced cavitometer. Journal of Materials Processing Technology, 229. pp. 582-586. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmatprotec.2015.10.009)

Activity model

Ciurana, J., Ferrer, I. and Gao, J. X. ORCID: 0000-0001-5625-3654 (2006) Activity model and computer aided system for defining sheet metal process planning. Journal of Materials Processing Technology, 173 (2). pp. 213-222. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmatprotec.2005.11.031)

aluminum alloy

Subroto, Tungky, Lebon, Gerard S. B., Eskin, Dmitry G., Skalicky, Ivan, Roberts, Dan, Tzanakis, Iakovos and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2021) Numerical modelling and experimental validation of the effect of ultrasonic melt treatment in a direct-chill cast AA6008 alloy billet. Journal of Materials Processing Technology, 12. pp. 1582-1596. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmrt.2021.03.061)

Cavitation bubbles

Tzanakis, I., Lebon, Gerard S. B., Eskin, D. G. and Pericleous, Kyriacos A. ORCID: 0000-0002-7426-9999 (2016) Characterisation of the ultrasonic acoustic spectrum and pressure field in aluminium melt with an advanced cavitometer. Journal of Materials Processing Technology, 229. pp. 582-586. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmatprotec.2015.10.009)

Cavitometer

Tzanakis, I., Lebon, Gerard S. B., Eskin, D. G. and Pericleous, Kyriacos A. ORCID: 0000-0002-7426-9999 (2016) Characterisation of the ultrasonic acoustic spectrum and pressure field in aluminium melt with an advanced cavitometer. Journal of Materials Processing Technology, 229. pp. 582-586. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmatprotec.2015.10.009)

composite materials manufacturing

Li, Nanya, Li, Yingguang, Hang, Xiang and Gao, James ORCID: 0000-0001-5625-3654 (2014) Analysis and optimization of temperature distribution in carbon fiber reinforced composite materials during microwave curing process. Journal of Materials Processing Technology, 214 (3). pp. 544-550. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmatprotec.2013.10.012)

Computer aided process planning

Ciurana, J., Ferrer, I. and Gao, J. X. ORCID: 0000-0001-5625-3654 (2006) Activity model and computer aided system for defining sheet metal process planning. Journal of Materials Processing Technology, 173 (2). pp. 213-222. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmatprotec.2005.11.031)

Decision support system

Ciurana, J., Ferrer, I. and Gao, J. X. ORCID: 0000-0001-5625-3654 (2006) Activity model and computer aided system for defining sheet metal process planning. Journal of Materials Processing Technology, 173 (2). pp. 213-222. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmatprotec.2005.11.031)

direct-chill (DC) casting

Subroto, Tungky, Lebon, Gerard S. B., Eskin, Dmitry G., Skalicky, Ivan, Roberts, Dan, Tzanakis, Iakovos and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2021) Numerical modelling and experimental validation of the effect of ultrasonic melt treatment in a direct-chill cast AA6008 alloy billet. Journal of Materials Processing Technology, 12. pp. 1582-1596. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmrt.2021.03.061)

Drawing processes

Ciurana, J., Ferrer, I. and Gao, J. X. ORCID: 0000-0001-5625-3654 (2006) Activity model and computer aided system for defining sheet metal process planning. Journal of Materials Processing Technology, 173 (2). pp. 213-222. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmatprotec.2005.11.031)

extrusion

Williams, A.J., Croft, T.N. and Cross, M. (2002) Computational modelling of metal extrusion and forging processes. Journal of Materials Processing Technology, 125-6. pp. 573-582. ISSN 0924-0136 (doi:https://doi.org/10.1016/S0924-0136(02)00401-6)

fatigue failures

Amalu, Emeka H. and Ekere, Ndy N. (2011) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmatprotec.2011.10.011)

finite volume

Williams, A.J., Croft, T.N. and Cross, M. (2002) Computational modelling of metal extrusion and forging processes. Journal of Materials Processing Technology, 125-6. pp. 573-582. ISSN 0924-0136 (doi:https://doi.org/10.1016/S0924-0136(02)00401-6)

flip chip

Amalu, Emeka H. and Ekere, Ndy N. (2011) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmatprotec.2011.10.011)

flip-chip

Durairaj, R., Mallik, S., Seman, A., Marks, A. and Ekere, N.N. (2009) Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly. Journal of Materials Processing Technology, 209 (8). pp. 3923-3930. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmatprotec.2008.09.013)

forging

Williams, A.J., Croft, T.N. and Cross, M. (2002) Computational modelling of metal extrusion and forging processes. Journal of Materials Processing Technology, 125-6. pp. 573-582. ISSN 0924-0136 (doi:https://doi.org/10.1016/S0924-0136(02)00401-6)

Frequency spectrum

Tzanakis, I., Lebon, Gerard S. B., Eskin, D. G. and Pericleous, Kyriacos A. ORCID: 0000-0002-7426-9999 (2016) Characterisation of the ultrasonic acoustic spectrum and pressure field in aluminium melt with an advanced cavitometer. Journal of Materials Processing Technology, 229. pp. 582-586. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmatprotec.2015.10.009)

high temperature electronics

Amalu, Emeka H. and Ekere, Ndy N. (2011) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmatprotec.2011.10.011)

intermetallic compound

Amalu, Emeka H. and Ekere, Ndy N. (2011) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmatprotec.2011.10.011)

isotropic conductive adhesives

Durairaj, R., Mallik, S., Seman, A., Marks, A. and Ekere, N.N. (2009) Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly. Journal of Materials Processing Technology, 209 (8). pp. 3923-3930. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmatprotec.2008.09.013)

lead-free

Durairaj, R., Mallik, S., Seman, A., Marks, A. and Ekere, N.N. (2009) Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly. Journal of Materials Processing Technology, 209 (8). pp. 3923-3930. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmatprotec.2008.09.013)

linear visco-elastic

Durairaj, R., Mallik, S., Seman, A., Marks, A. and Ekere, N.N. (2009) Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly. Journal of Materials Processing Technology, 209 (8). pp. 3923-3930. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmatprotec.2008.09.013)

Liquid aluminium

Tzanakis, I., Lebon, Gerard S. B., Eskin, D. G. and Pericleous, Kyriacos A. ORCID: 0000-0002-7426-9999 (2016) Characterisation of the ultrasonic acoustic spectrum and pressure field in aluminium melt with an advanced cavitometer. Journal of Materials Processing Technology, 229. pp. 582-586. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmatprotec.2015.10.009)

microelectronics reliability

Amalu, Emeka H. and Ekere, Ndy N. (2011) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmatprotec.2011.10.011)

microwave curing

Li, Nanya, Li, Yingguang, Hang, Xiang and Gao, James ORCID: 0000-0001-5625-3654 (2014) Analysis and optimization of temperature distribution in carbon fiber reinforced composite materials during microwave curing process. Journal of Materials Processing Technology, 214 (3). pp. 544-550. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmatprotec.2013.10.012)

numerical modeling

Subroto, Tungky, Lebon, Gerard S. B., Eskin, Dmitry G., Skalicky, Ivan, Roberts, Dan, Tzanakis, Iakovos and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2021) Numerical modelling and experimental validation of the effect of ultrasonic melt treatment in a direct-chill cast AA6008 alloy billet. Journal of Materials Processing Technology, 12. pp. 1582-1596. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmrt.2021.03.061)

optimization

Li, Nanya, Li, Yingguang, Hang, Xiang and Gao, James ORCID: 0000-0001-5625-3654 (2014) Analysis and optimization of temperature distribution in carbon fiber reinforced composite materials during microwave curing process. Journal of Materials Processing Technology, 214 (3). pp. 544-550. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmatprotec.2013.10.012)

Pb-free solder

Amalu, Emeka H. and Ekere, Ndy N. (2011) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmatprotec.2011.10.011)

power electronics

Amalu, Emeka H. and Ekere, Ndy N. (2011) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmatprotec.2011.10.011)

rheology

Durairaj, R., Mallik, S., Seman, A., Marks, A. and Ekere, N.N. (2009) Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly. Journal of Materials Processing Technology, 209 (8). pp. 3923-3930. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmatprotec.2008.09.013)

Sheet metal processes

Ciurana, J., Ferrer, I. and Gao, J. X. ORCID: 0000-0001-5625-3654 (2006) Activity model and computer aided system for defining sheet metal process planning. Journal of Materials Processing Technology, 173 (2). pp. 213-222. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmatprotec.2005.11.031)

solder joint

Amalu, Emeka H. and Ekere, Ndy N. (2011) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmatprotec.2011.10.011)

solder paste

Durairaj, R., Mallik, S., Seman, A., Marks, A. and Ekere, N.N. (2009) Rheological characterisation of solder pastes and isotropic conductive adhesives used for flip-chip assembly. Journal of Materials Processing Technology, 209 (8). pp. 3923-3930. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmatprotec.2008.09.013)

temperature distribution

Li, Nanya, Li, Yingguang, Hang, Xiang and Gao, James ORCID: 0000-0001-5625-3654 (2014) Analysis and optimization of temperature distribution in carbon fiber reinforced composite materials during microwave curing process. Journal of Materials Processing Technology, 214 (3). pp. 544-550. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmatprotec.2013.10.012)

temperature measurement

Subroto, Tungky, Lebon, Gerard S. B., Eskin, Dmitry G., Skalicky, Ivan, Roberts, Dan, Tzanakis, Iakovos and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2021) Numerical modelling and experimental validation of the effect of ultrasonic melt treatment in a direct-chill cast AA6008 alloy billet. Journal of Materials Processing Technology, 12. pp. 1582-1596. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmrt.2021.03.061)

Ultrasonic melt treatment

Subroto, Tungky, Lebon, Gerard S. B., Eskin, Dmitry G., Skalicky, Ivan, Roberts, Dan, Tzanakis, Iakovos and Pericleous, Koulis ORCID: 0000-0002-7426-9999 (2021) Numerical modelling and experimental validation of the effect of ultrasonic melt treatment in a direct-chill cast AA6008 alloy billet. Journal of Materials Processing Technology, 12. pp. 1582-1596. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmrt.2021.03.061)

Ultrasound

Tzanakis, I., Lebon, Gerard S. B., Eskin, D. G. and Pericleous, Kyriacos A. ORCID: 0000-0002-7426-9999 (2016) Characterisation of the ultrasonic acoustic spectrum and pressure field in aluminium melt with an advanced cavitometer. Journal of Materials Processing Technology, 229. pp. 582-586. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmatprotec.2015.10.009)

This list was generated on Wed Nov 20 16:57:41 2024 UTC.