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Number of items: 2.

Article

Mallik, S., Ekere, N.N., Marks, A.E., Seman, A. and Durairaj, R. (2010) Modeling the structural breakdown of solder paste using the structural kinetic model. Journal of Materials Engineering and Performance, 19 (1). pp. 40-45. ISSN 1059-9495 (Print), 1544-1024 (Online) (doi:10.1007/s11665-009-9448-0)

Mallik, Sabuj, Chan, Erica Hiu Laam and Ekere, Ndy (2012) Nonlinear Viscoelastic Characteristics of Sn-Ag-Cu Solder Pastes Used in Electronics Assembly Applications. Journal of Materials Engineering and Performance, 22 (4). pp. 1186-1193. ISSN 1059-9495 (Print), 1544-1024 (Online) (doi:10.1007/s11665-012-0360-7)

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