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Group by: Creators | Item Type | Uncontrolled Keywords | No Grouping
computer simulation design event history analysis fatigue flip-chip geometry Kriging materials properties microsystems power electronic module probabilistic optimisation radial basis reduced order models reliability risk analysis solder joints solders
Number of items: 17.

computer simulation

Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 and Cross, M. (2000) Reliability analysis of flip chip designs via computer simulation. Journal of Electronic Packaging, 122 (3). pp. 214-219. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:https://doi.org/10.1115/1.1286122)

design

Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 and Cross, M. (2000) Reliability analysis of flip chip designs via computer simulation. Journal of Electronic Packaging, 122 (3). pp. 214-219. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:https://doi.org/10.1115/1.1286122)

event history analysis

Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 and Cross, M. (2000) Reliability analysis of flip chip designs via computer simulation. Journal of Electronic Packaging, 122 (3). pp. 214-219. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:https://doi.org/10.1115/1.1286122)

fatigue

Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 and Cross, M. (2000) Reliability analysis of flip chip designs via computer simulation. Journal of Electronic Packaging, 122 (3). pp. 214-219. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:https://doi.org/10.1115/1.1286122)

flip-chip

Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 and Cross, M. (2000) Reliability analysis of flip chip designs via computer simulation. Journal of Electronic Packaging, 122 (3). pp. 214-219. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:https://doi.org/10.1115/1.1286122)

geometry

Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 and Cross, M. (2000) Reliability analysis of flip chip designs via computer simulation. Journal of Electronic Packaging, 122 (3). pp. 214-219. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:https://doi.org/10.1115/1.1286122)

Kriging

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2013) Application of Kriging and radial basis function for reliability optimization in power modules. Journal of Electronic Packaging, 135 (2):021009. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:https://doi.org/10.1115/1.4024056)

materials properties

Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 and Cross, M. (2000) Reliability analysis of flip chip designs via computer simulation. Journal of Electronic Packaging, 122 (3). pp. 214-219. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:https://doi.org/10.1115/1.1286122)

microsystems

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2013) Application of Kriging and radial basis function for reliability optimization in power modules. Journal of Electronic Packaging, 135 (2):021009. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:https://doi.org/10.1115/1.4024056)

power electronic module

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2013) Application of Kriging and radial basis function for reliability optimization in power modules. Journal of Electronic Packaging, 135 (2):021009. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:https://doi.org/10.1115/1.4024056)

probabilistic optimisation

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2013) Application of Kriging and radial basis function for reliability optimization in power modules. Journal of Electronic Packaging, 135 (2):021009. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:https://doi.org/10.1115/1.4024056)

radial basis

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2013) Application of Kriging and radial basis function for reliability optimization in power modules. Journal of Electronic Packaging, 135 (2):021009. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:https://doi.org/10.1115/1.4024056)

reduced order models

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2013) Application of Kriging and radial basis function for reliability optimization in power modules. Journal of Electronic Packaging, 135 (2):021009. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:https://doi.org/10.1115/1.4024056)

reliability

Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 and Cross, M. (2000) Reliability analysis of flip chip designs via computer simulation. Journal of Electronic Packaging, 122 (3). pp. 214-219. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:https://doi.org/10.1115/1.1286122)

risk analysis

Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2013) Application of Kriging and radial basis function for reliability optimization in power modules. Journal of Electronic Packaging, 135 (2):021009. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:https://doi.org/10.1115/1.4024056)

solder joints

Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 and Cross, M. (2000) Reliability analysis of flip chip designs via computer simulation. Journal of Electronic Packaging, 122 (3). pp. 214-219. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:https://doi.org/10.1115/1.1286122)

solders

Lu, Hua ORCID: 0000-0002-4392-6562 , Bailey, C. ORCID: 0000-0002-9438-3879 and Cross, M. (2000) Reliability analysis of flip chip designs via computer simulation. Journal of Electronic Packaging, 122 (3). pp. 214-219. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:https://doi.org/10.1115/1.1286122)

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