Browse by Journal Title
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computer simulation
Lu, Hua
ORCID: 0000-0002-4392-6562
, Bailey, C.
ORCID: 0000-0002-9438-3879
and Cross, M.
(2000)
Reliability analysis of flip chip designs via computer simulation.
Journal of Electronic Packaging, 122 (3).
pp. 214-219.
ISSN 1528-9044 (Print), 1043-7398 (Online)
(doi:https://doi.org/10.1115/1.1286122)
design
Lu, Hua
ORCID: 0000-0002-4392-6562
, Bailey, C.
ORCID: 0000-0002-9438-3879
and Cross, M.
(2000)
Reliability analysis of flip chip designs via computer simulation.
Journal of Electronic Packaging, 122 (3).
pp. 214-219.
ISSN 1528-9044 (Print), 1043-7398 (Online)
(doi:https://doi.org/10.1115/1.1286122)
event history analysis
Lu, Hua
ORCID: 0000-0002-4392-6562
, Bailey, C.
ORCID: 0000-0002-9438-3879
and Cross, M.
(2000)
Reliability analysis of flip chip designs via computer simulation.
Journal of Electronic Packaging, 122 (3).
pp. 214-219.
ISSN 1528-9044 (Print), 1043-7398 (Online)
(doi:https://doi.org/10.1115/1.1286122)
fatigue
Lu, Hua
ORCID: 0000-0002-4392-6562
, Bailey, C.
ORCID: 0000-0002-9438-3879
and Cross, M.
(2000)
Reliability analysis of flip chip designs via computer simulation.
Journal of Electronic Packaging, 122 (3).
pp. 214-219.
ISSN 1528-9044 (Print), 1043-7398 (Online)
(doi:https://doi.org/10.1115/1.1286122)
flip-chip
Lu, Hua
ORCID: 0000-0002-4392-6562
, Bailey, C.
ORCID: 0000-0002-9438-3879
and Cross, M.
(2000)
Reliability analysis of flip chip designs via computer simulation.
Journal of Electronic Packaging, 122 (3).
pp. 214-219.
ISSN 1528-9044 (Print), 1043-7398 (Online)
(doi:https://doi.org/10.1115/1.1286122)
geometry
Lu, Hua
ORCID: 0000-0002-4392-6562
, Bailey, C.
ORCID: 0000-0002-9438-3879
and Cross, M.
(2000)
Reliability analysis of flip chip designs via computer simulation.
Journal of Electronic Packaging, 122 (3).
pp. 214-219.
ISSN 1528-9044 (Print), 1043-7398 (Online)
(doi:https://doi.org/10.1115/1.1286122)
Kriging
Rajaguru, Pushparajah
ORCID: 0000-0002-6041-0517
, Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Lu, Hua
ORCID: 0000-0002-4392-6562
and Bailey, Christopher
ORCID: 0000-0002-9438-3879
(2013)
Application of Kriging and radial basis function for reliability optimization in power modules.
Journal of Electronic Packaging, 135 (2):021009.
ISSN 1528-9044 (Print), 1043-7398 (Online)
(doi:https://doi.org/10.1115/1.4024056)
materials properties
Lu, Hua
ORCID: 0000-0002-4392-6562
, Bailey, C.
ORCID: 0000-0002-9438-3879
and Cross, M.
(2000)
Reliability analysis of flip chip designs via computer simulation.
Journal of Electronic Packaging, 122 (3).
pp. 214-219.
ISSN 1528-9044 (Print), 1043-7398 (Online)
(doi:https://doi.org/10.1115/1.1286122)
microsystems
Rajaguru, Pushparajah
ORCID: 0000-0002-6041-0517
, Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Lu, Hua
ORCID: 0000-0002-4392-6562
and Bailey, Christopher
ORCID: 0000-0002-9438-3879
(2013)
Application of Kriging and radial basis function for reliability optimization in power modules.
Journal of Electronic Packaging, 135 (2):021009.
ISSN 1528-9044 (Print), 1043-7398 (Online)
(doi:https://doi.org/10.1115/1.4024056)
power electronic module
Rajaguru, Pushparajah
ORCID: 0000-0002-6041-0517
, Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Lu, Hua
ORCID: 0000-0002-4392-6562
and Bailey, Christopher
ORCID: 0000-0002-9438-3879
(2013)
Application of Kriging and radial basis function for reliability optimization in power modules.
Journal of Electronic Packaging, 135 (2):021009.
ISSN 1528-9044 (Print), 1043-7398 (Online)
(doi:https://doi.org/10.1115/1.4024056)
probabilistic optimisation
Rajaguru, Pushparajah
ORCID: 0000-0002-6041-0517
, Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Lu, Hua
ORCID: 0000-0002-4392-6562
and Bailey, Christopher
ORCID: 0000-0002-9438-3879
(2013)
Application of Kriging and radial basis function for reliability optimization in power modules.
Journal of Electronic Packaging, 135 (2):021009.
ISSN 1528-9044 (Print), 1043-7398 (Online)
(doi:https://doi.org/10.1115/1.4024056)
radial basis
Rajaguru, Pushparajah
ORCID: 0000-0002-6041-0517
, Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Lu, Hua
ORCID: 0000-0002-4392-6562
and Bailey, Christopher
ORCID: 0000-0002-9438-3879
(2013)
Application of Kriging and radial basis function for reliability optimization in power modules.
Journal of Electronic Packaging, 135 (2):021009.
ISSN 1528-9044 (Print), 1043-7398 (Online)
(doi:https://doi.org/10.1115/1.4024056)
reduced order models
Rajaguru, Pushparajah
ORCID: 0000-0002-6041-0517
, Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Lu, Hua
ORCID: 0000-0002-4392-6562
and Bailey, Christopher
ORCID: 0000-0002-9438-3879
(2013)
Application of Kriging and radial basis function for reliability optimization in power modules.
Journal of Electronic Packaging, 135 (2):021009.
ISSN 1528-9044 (Print), 1043-7398 (Online)
(doi:https://doi.org/10.1115/1.4024056)
reliability
Lu, Hua
ORCID: 0000-0002-4392-6562
, Bailey, C.
ORCID: 0000-0002-9438-3879
and Cross, M.
(2000)
Reliability analysis of flip chip designs via computer simulation.
Journal of Electronic Packaging, 122 (3).
pp. 214-219.
ISSN 1528-9044 (Print), 1043-7398 (Online)
(doi:https://doi.org/10.1115/1.1286122)
risk analysis
Rajaguru, Pushparajah
ORCID: 0000-0002-6041-0517
, Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Lu, Hua
ORCID: 0000-0002-4392-6562
and Bailey, Christopher
ORCID: 0000-0002-9438-3879
(2013)
Application of Kriging and radial basis function for reliability optimization in power modules.
Journal of Electronic Packaging, 135 (2):021009.
ISSN 1528-9044 (Print), 1043-7398 (Online)
(doi:https://doi.org/10.1115/1.4024056)
solder joints
Lu, Hua
ORCID: 0000-0002-4392-6562
, Bailey, C.
ORCID: 0000-0002-9438-3879
and Cross, M.
(2000)
Reliability analysis of flip chip designs via computer simulation.
Journal of Electronic Packaging, 122 (3).
pp. 214-219.
ISSN 1528-9044 (Print), 1043-7398 (Online)
(doi:https://doi.org/10.1115/1.1286122)
solders
Lu, Hua
ORCID: 0000-0002-4392-6562
, Bailey, C.
ORCID: 0000-0002-9438-3879
and Cross, M.
(2000)
Reliability analysis of flip chip designs via computer simulation.
Journal of Electronic Packaging, 122 (3).
pp. 214-219.
ISSN 1528-9044 (Print), 1043-7398 (Online)
(doi:https://doi.org/10.1115/1.1286122)