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Number of items: 9.

alloying additions

Alam, M.O., Chan, Y.C. and Tu, K.N. (2003) Effect of 0.5 wt % Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization. Journal of Applied Physics, 94 (12). pp. 7904-7909. ISSN 0021-8979 (Print), 1089-7550 (Online) (doi:https://doi.org/10.1063/1.1628387)

copper alloys

Alam, M.O., Chan, Y.C. and Tu, K.N. (2003) Effect of 0.5 wt % Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization. Journal of Applied Physics, 94 (12). pp. 7904-7909. ISSN 0021-8979 (Print), 1089-7550 (Online) (doi:https://doi.org/10.1063/1.1628387)

dissolving

Alam, M.O., Chan, Y.C. and Tu, K.N. (2003) Effect of 0.5 wt % Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization. Journal of Applied Physics, 94 (12). pp. 7904-7909. ISSN 0021-8979 (Print), 1089-7550 (Online) (doi:https://doi.org/10.1063/1.1628387)

eutectic alloys

Alam, M.O., Chan, Y.C. and Tu, K.N. (2003) Effect of 0.5 wt % Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization. Journal of Applied Physics, 94 (12). pp. 7904-7909. ISSN 0021-8979 (Print), 1089-7550 (Online) (doi:https://doi.org/10.1063/1.1628387)

integrated circuit metallisation

Alam, M.O., Chan, Y.C. and Tu, K.N. (2003) Effect of 0.5 wt % Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization. Journal of Applied Physics, 94 (12). pp. 7904-7909. ISSN 0021-8979 (Print), 1089-7550 (Online) (doi:https://doi.org/10.1063/1.1628387)

nucleation

Alam, M.O., Chan, Y.C. and Tu, K.N. (2003) Effect of 0.5 wt % Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization. Journal of Applied Physics, 94 (12). pp. 7904-7909. ISSN 0021-8979 (Print), 1089-7550 (Online) (doi:https://doi.org/10.1063/1.1628387)

silver alloys

Alam, M.O., Chan, Y.C. and Tu, K.N. (2003) Effect of 0.5 wt % Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization. Journal of Applied Physics, 94 (12). pp. 7904-7909. ISSN 0021-8979 (Print), 1089-7550 (Online) (doi:https://doi.org/10.1063/1.1628387)

soldering

Alam, M.O., Chan, Y.C. and Tu, K.N. (2003) Effect of 0.5 wt % Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization. Journal of Applied Physics, 94 (12). pp. 7904-7909. ISSN 0021-8979 (Print), 1089-7550 (Online) (doi:https://doi.org/10.1063/1.1628387)

tin alloys

Alam, M.O., Chan, Y.C. and Tu, K.N. (2003) Effect of 0.5 wt % Cu addition in Sn–3.5% Ag solder on the dissolution rate of Cu metallization. Journal of Applied Physics, 94 (12). pp. 7904-7909. ISSN 0021-8979 (Print), 1089-7550 (Online) (doi:https://doi.org/10.1063/1.1628387)

This list was generated on Sun Apr 21 12:47:29 2019 UTC.