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Group by: Creators | Item Type | Uncontrolled Keywords | No Grouping
aging compressive strength contact angle elastic modulus flux growth rate High pressure Hydrogen storage hydroxyapatite interfacial reactions intermetallic compound layer intermetallic compounds metal–hydrogen systems modeling Monte Carlo calculations nuclear magnetic relaxation Phase transition porous implant rapid microwave sintering rare earth intermetallic compounds site occupancy solder soldering Synchrotron X-ray powder diffraction theory and modeling titanium composite wetting wetting force
Number of items: 31.

aging

Rizvi, M.J., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C., Islam, M. and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2007) Effect of adding 0.3wt% Ni into the Sn-0.7wt% Cu solder - Part II: Growth of intermetallic layer with Cu during wetting and aging. Journal of Alloys and Compounds, 438 (1-2). pp. 122-128. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.071)

Rizvi, M.J., Chan, Y.C., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Islam, M.N. (2006) Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407 (1-2). pp. 208-214. ISSN 0925-8388 (doi:10.1016/j.jallcom.2005.06.050)

compressive strength

Chander, Prakash, Sunpreet, Singh, Seeram, Ramakrishna, Grzegorz, Królczyk and Le, Chi H. ORCID logoORCID: https://orcid.org/0000-0002-5168-2297 (2020) Microwave sintering of porous Ti-Nb-HA composite with high strength and enhanced bioactivity for implant applications. Journal of Alloys and Compounds, 824:153774. ISSN 0925-8388 (doi:10.1016/j.jallcom.2020.153774)

contact angle

Rizvi, M.J., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C. and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2007) Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: part I: wetting behavior on Cu and Ni substrates. Journal of Alloys and Compounds, 438 (1-2). pp. 116-121. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.048)

elastic modulus

Chander, Prakash, Sunpreet, Singh, Seeram, Ramakrishna, Grzegorz, Królczyk and Le, Chi H. ORCID logoORCID: https://orcid.org/0000-0002-5168-2297 (2020) Microwave sintering of porous Ti-Nb-HA composite with high strength and enhanced bioactivity for implant applications. Journal of Alloys and Compounds, 824:153774. ISSN 0925-8388 (doi:10.1016/j.jallcom.2020.153774)

flux

Rizvi, M.J., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C. and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2007) Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: part I: wetting behavior on Cu and Ni substrates. Journal of Alloys and Compounds, 438 (1-2). pp. 116-121. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.048)

growth rate

Rizvi, M.J., Chan, Y.C., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Islam, M.N. (2006) Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407 (1-2). pp. 208-214. ISSN 0925-8388 (doi:10.1016/j.jallcom.2005.06.050)

High pressure

Szilágyi, Petra Á., Hunter, Steven, Morrison, Carole A., Tang, Chiu C. and Pulham, Colin R. (2017) Pressure-induced structural changes in methylamine borane and dimethylamine borane. Journal of Alloys and Compounds, 722. pp. 953-961. ISSN 0925-8388 (doi:10.1016/j.jallcom.2017.06.174)

Hydrogen storage

Szilágyi, Petra Á., Hunter, Steven, Morrison, Carole A., Tang, Chiu C. and Pulham, Colin R. (2017) Pressure-induced structural changes in methylamine borane and dimethylamine borane. Journal of Alloys and Compounds, 722. pp. 953-961. ISSN 0925-8388 (doi:10.1016/j.jallcom.2017.06.174)

hydroxyapatite

Chander, Prakash, Sunpreet, Singh, Seeram, Ramakrishna, Grzegorz, Królczyk and Le, Chi H. ORCID logoORCID: https://orcid.org/0000-0002-5168-2297 (2020) Microwave sintering of porous Ti-Nb-HA composite with high strength and enhanced bioactivity for implant applications. Journal of Alloys and Compounds, 824:153774. ISSN 0925-8388 (doi:10.1016/j.jallcom.2020.153774)

interfacial reactions

Rizvi, M.J., Chan, Y.C., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Islam, M.N. (2006) Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407 (1-2). pp. 208-214. ISSN 0925-8388 (doi:10.1016/j.jallcom.2005.06.050)

intermetallic compound layer

Rizvi, M.J., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C., Islam, M. and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2007) Effect of adding 0.3wt% Ni into the Sn-0.7wt% Cu solder - Part II: Growth of intermetallic layer with Cu during wetting and aging. Journal of Alloys and Compounds, 438 (1-2). pp. 122-128. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.071)

intermetallic compounds

Rizvi, M.J., Chan, Y.C., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Islam, M.N. (2006) Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407 (1-2). pp. 208-214. ISSN 0925-8388 (doi:10.1016/j.jallcom.2005.06.050)

metal–hydrogen systems

Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Zhang, Xiaohong and Titman, J.M. (1997) Measuring distributions of jump rates in disordered metal–hydrogen systems by nuclear magnetic relaxation. Journal of Alloys and Compounds, 253. pp. 425-427. ISSN 0925-8388 (doi:10.1016/S0925-8388(96)03083-6)

modeling

Rizvi, M.J., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C. and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2007) Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: part I: wetting behavior on Cu and Ni substrates. Journal of Alloys and Compounds, 438 (1-2). pp. 116-121. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.048)

Monte Carlo calculations

Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Zhang, Xiaohong and Titman, J.M. (1997) Measuring distributions of jump rates in disordered metal–hydrogen systems by nuclear magnetic relaxation. Journal of Alloys and Compounds, 253. pp. 425-427. ISSN 0925-8388 (doi:10.1016/S0925-8388(96)03083-6)

nuclear magnetic relaxation

Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Zhang, Xiaohong and Titman, J.M. (1997) Measuring distributions of jump rates in disordered metal–hydrogen systems by nuclear magnetic relaxation. Journal of Alloys and Compounds, 253. pp. 425-427. ISSN 0925-8388 (doi:10.1016/S0925-8388(96)03083-6)

Phase transition

Szilágyi, Petra Á., Hunter, Steven, Morrison, Carole A., Tang, Chiu C. and Pulham, Colin R. (2017) Pressure-induced structural changes in methylamine borane and dimethylamine borane. Journal of Alloys and Compounds, 722. pp. 953-961. ISSN 0925-8388 (doi:10.1016/j.jallcom.2017.06.174)

porous implant

Chander, Prakash, Sunpreet, Singh, Seeram, Ramakrishna, Grzegorz, Królczyk and Le, Chi H. ORCID logoORCID: https://orcid.org/0000-0002-5168-2297 (2020) Microwave sintering of porous Ti-Nb-HA composite with high strength and enhanced bioactivity for implant applications. Journal of Alloys and Compounds, 824:153774. ISSN 0925-8388 (doi:10.1016/j.jallcom.2020.153774)

rapid microwave sintering

Chander, Prakash, Sunpreet, Singh, Seeram, Ramakrishna, Grzegorz, Królczyk and Le, Chi H. ORCID logoORCID: https://orcid.org/0000-0002-5168-2297 (2020) Microwave sintering of porous Ti-Nb-HA composite with high strength and enhanced bioactivity for implant applications. Journal of Alloys and Compounds, 824:153774. ISSN 0925-8388 (doi:10.1016/j.jallcom.2020.153774)

rare earth intermetallic compounds

Wang, Yi, Shen, J., Chen, N.X. and Wang, J.L. (2001) Theoretical investigation on site preference of foreign atoms in rare-earth intermetallics. Journal of Alloys and Compounds, 319 (1-2). pp. 62-73. ISSN 0925-8388 (doi:10.1016/S0925-8388(01)00909-4)

site occupancy

Wang, Yi, Shen, J., Chen, N.X. and Wang, J.L. (2001) Theoretical investigation on site preference of foreign atoms in rare-earth intermetallics. Journal of Alloys and Compounds, 319 (1-2). pp. 62-73. ISSN 0925-8388 (doi:10.1016/S0925-8388(01)00909-4)

solder

Rizvi, M.J., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C., Islam, M. and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2007) Effect of adding 0.3wt% Ni into the Sn-0.7wt% Cu solder - Part II: Growth of intermetallic layer with Cu during wetting and aging. Journal of Alloys and Compounds, 438 (1-2). pp. 122-128. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.071)

Rizvi, M.J., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C. and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2007) Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: part I: wetting behavior on Cu and Ni substrates. Journal of Alloys and Compounds, 438 (1-2). pp. 116-121. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.048)

soldering

Rizvi, M.J., Chan, Y.C., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Islam, M.N. (2006) Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407 (1-2). pp. 208-214. ISSN 0925-8388 (doi:10.1016/j.jallcom.2005.06.050)

Synchrotron X-ray powder diffraction

Szilágyi, Petra Á., Hunter, Steven, Morrison, Carole A., Tang, Chiu C. and Pulham, Colin R. (2017) Pressure-induced structural changes in methylamine borane and dimethylamine borane. Journal of Alloys and Compounds, 722. pp. 953-961. ISSN 0925-8388 (doi:10.1016/j.jallcom.2017.06.174)

theory and modeling

Wang, Yi, Shen, J., Chen, N.X. and Wang, J.L. (2001) Theoretical investigation on site preference of foreign atoms in rare-earth intermetallics. Journal of Alloys and Compounds, 319 (1-2). pp. 62-73. ISSN 0925-8388 (doi:10.1016/S0925-8388(01)00909-4)

titanium composite

Chander, Prakash, Sunpreet, Singh, Seeram, Ramakrishna, Grzegorz, Królczyk and Le, Chi H. ORCID logoORCID: https://orcid.org/0000-0002-5168-2297 (2020) Microwave sintering of porous Ti-Nb-HA composite with high strength and enhanced bioactivity for implant applications. Journal of Alloys and Compounds, 824:153774. ISSN 0925-8388 (doi:10.1016/j.jallcom.2020.153774)

wetting

Rizvi, M.J., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C., Islam, M. and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2007) Effect of adding 0.3wt% Ni into the Sn-0.7wt% Cu solder - Part II: Growth of intermetallic layer with Cu during wetting and aging. Journal of Alloys and Compounds, 438 (1-2). pp. 122-128. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.071)

Rizvi, M.J., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C. and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2007) Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: part I: wetting behavior on Cu and Ni substrates. Journal of Alloys and Compounds, 438 (1-2). pp. 116-121. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.048)

wetting force

Rizvi, M.J., Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C. and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2007) Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: part I: wetting behavior on Cu and Ni substrates. Journal of Alloys and Compounds, 438 (1-2). pp. 116-121. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.048)

This list was generated on Sat Dec 21 15:59:47 2024 UTC.