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aging
Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C., Islam, M. and Lu, Hua ORCID: 0000-0002-4392-6562 (2007) Effect of adding 0.3wt% Ni into the Sn-0.7wt% Cu solder - Part II: Growth of intermetallic layer with Cu during wetting and aging. Journal of Alloys and Compounds, 438 (1-2). pp. 122-128. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2006.08.071)
Rizvi, M.J., Chan, Y.C., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 and Islam, M.N. (2006) Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407 (1-2). pp. 208-214. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2005.06.050)
compressive strength
Chander, Prakash, Sunpreet, Singh, Seeram, Ramakrishna, Grzegorz, Królczyk and Le, Chi H. ORCID: 0000-0002-5168-2297 (2020) Microwave sintering of porous Ti-Nb-HA composite with high strength and enhanced bioactivity for implant applications. Journal of Alloys and Compounds, 824:153774. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2020.153774)
contact angle
Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Lu, Hua ORCID: 0000-0002-4392-6562 (2007) Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: part I: wetting behavior on Cu and Ni substrates. Journal of Alloys and Compounds, 438 (1-2). pp. 116-121. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2006.08.048)
elastic modulus
Chander, Prakash, Sunpreet, Singh, Seeram, Ramakrishna, Grzegorz, Królczyk and Le, Chi H. ORCID: 0000-0002-5168-2297 (2020) Microwave sintering of porous Ti-Nb-HA composite with high strength and enhanced bioactivity for implant applications. Journal of Alloys and Compounds, 824:153774. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2020.153774)
flux
Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Lu, Hua ORCID: 0000-0002-4392-6562 (2007) Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: part I: wetting behavior on Cu and Ni substrates. Journal of Alloys and Compounds, 438 (1-2). pp. 116-121. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2006.08.048)
growth rate
Rizvi, M.J., Chan, Y.C., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 and Islam, M.N. (2006) Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407 (1-2). pp. 208-214. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2005.06.050)
High pressure
Szilágyi, Petra Á., Hunter, Steven, Morrison, Carole A., Tang, Chiu C. and Pulham, Colin R. (2017) Pressure-induced structural changes in methylamine borane and dimethylamine borane. Journal of Alloys and Compounds, 722. pp. 953-961. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2017.06.174)
Hydrogen storage
Szilágyi, Petra Á., Hunter, Steven, Morrison, Carole A., Tang, Chiu C. and Pulham, Colin R. (2017) Pressure-induced structural changes in methylamine borane and dimethylamine borane. Journal of Alloys and Compounds, 722. pp. 953-961. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2017.06.174)
hydroxyapatite
Chander, Prakash, Sunpreet, Singh, Seeram, Ramakrishna, Grzegorz, Królczyk and Le, Chi H. ORCID: 0000-0002-5168-2297 (2020) Microwave sintering of porous Ti-Nb-HA composite with high strength and enhanced bioactivity for implant applications. Journal of Alloys and Compounds, 824:153774. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2020.153774)
interfacial reactions
Rizvi, M.J., Chan, Y.C., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 and Islam, M.N. (2006) Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407 (1-2). pp. 208-214. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2005.06.050)
intermetallic compound layer
Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C., Islam, M. and Lu, Hua ORCID: 0000-0002-4392-6562 (2007) Effect of adding 0.3wt% Ni into the Sn-0.7wt% Cu solder - Part II: Growth of intermetallic layer with Cu during wetting and aging. Journal of Alloys and Compounds, 438 (1-2). pp. 122-128. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2006.08.071)
intermetallic compounds
Rizvi, M.J., Chan, Y.C., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 and Islam, M.N. (2006) Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407 (1-2). pp. 208-214. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2005.06.050)
metal–hydrogen systems
Lu, Hua ORCID: 0000-0002-4392-6562 , Zhang, Xiaohong and Titman, J.M. (1997) Measuring distributions of jump rates in disordered metal–hydrogen systems by nuclear magnetic relaxation. Journal of Alloys and Compounds, 253. pp. 425-427. ISSN 0925-8388 (doi:https://doi.org/10.1016/S0925-8388(96)03083-6)
modeling
Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Lu, Hua ORCID: 0000-0002-4392-6562 (2007) Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: part I: wetting behavior on Cu and Ni substrates. Journal of Alloys and Compounds, 438 (1-2). pp. 116-121. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2006.08.048)
Monte Carlo calculations
Lu, Hua ORCID: 0000-0002-4392-6562 , Zhang, Xiaohong and Titman, J.M. (1997) Measuring distributions of jump rates in disordered metal–hydrogen systems by nuclear magnetic relaxation. Journal of Alloys and Compounds, 253. pp. 425-427. ISSN 0925-8388 (doi:https://doi.org/10.1016/S0925-8388(96)03083-6)
nuclear magnetic relaxation
Lu, Hua ORCID: 0000-0002-4392-6562 , Zhang, Xiaohong and Titman, J.M. (1997) Measuring distributions of jump rates in disordered metal–hydrogen systems by nuclear magnetic relaxation. Journal of Alloys and Compounds, 253. pp. 425-427. ISSN 0925-8388 (doi:https://doi.org/10.1016/S0925-8388(96)03083-6)
Phase transition
Szilágyi, Petra Á., Hunter, Steven, Morrison, Carole A., Tang, Chiu C. and Pulham, Colin R. (2017) Pressure-induced structural changes in methylamine borane and dimethylamine borane. Journal of Alloys and Compounds, 722. pp. 953-961. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2017.06.174)
porous implant
Chander, Prakash, Sunpreet, Singh, Seeram, Ramakrishna, Grzegorz, Królczyk and Le, Chi H. ORCID: 0000-0002-5168-2297 (2020) Microwave sintering of porous Ti-Nb-HA composite with high strength and enhanced bioactivity for implant applications. Journal of Alloys and Compounds, 824:153774. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2020.153774)
rapid microwave sintering
Chander, Prakash, Sunpreet, Singh, Seeram, Ramakrishna, Grzegorz, Królczyk and Le, Chi H. ORCID: 0000-0002-5168-2297 (2020) Microwave sintering of porous Ti-Nb-HA composite with high strength and enhanced bioactivity for implant applications. Journal of Alloys and Compounds, 824:153774. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2020.153774)
rare earth intermetallic compounds
Wang, Yi, Shen, J., Chen, N.X. and Wang, J.L. (2001) Theoretical investigation on site preference of foreign atoms in rare-earth intermetallics. Journal of Alloys and Compounds, 319 (1-2). pp. 62-73. ISSN 0925-8388 (doi:https://doi.org/10.1016/S0925-8388(01)00909-4)
site occupancy
Wang, Yi, Shen, J., Chen, N.X. and Wang, J.L. (2001) Theoretical investigation on site preference of foreign atoms in rare-earth intermetallics. Journal of Alloys and Compounds, 319 (1-2). pp. 62-73. ISSN 0925-8388 (doi:https://doi.org/10.1016/S0925-8388(01)00909-4)
solder
Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C., Islam, M. and Lu, Hua ORCID: 0000-0002-4392-6562 (2007) Effect of adding 0.3wt% Ni into the Sn-0.7wt% Cu solder - Part II: Growth of intermetallic layer with Cu during wetting and aging. Journal of Alloys and Compounds, 438 (1-2). pp. 122-128. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2006.08.071)
Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Lu, Hua ORCID: 0000-0002-4392-6562 (2007) Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: part I: wetting behavior on Cu and Ni substrates. Journal of Alloys and Compounds, 438 (1-2). pp. 116-121. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2006.08.048)
soldering
Rizvi, M.J., Chan, Y.C., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Lu, Hua ORCID: 0000-0002-4392-6562 and Islam, M.N. (2006) Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407 (1-2). pp. 208-214. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2005.06.050)
Synchrotron X-ray powder diffraction
Szilágyi, Petra Á., Hunter, Steven, Morrison, Carole A., Tang, Chiu C. and Pulham, Colin R. (2017) Pressure-induced structural changes in methylamine borane and dimethylamine borane. Journal of Alloys and Compounds, 722. pp. 953-961. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2017.06.174)
theory and modeling
Wang, Yi, Shen, J., Chen, N.X. and Wang, J.L. (2001) Theoretical investigation on site preference of foreign atoms in rare-earth intermetallics. Journal of Alloys and Compounds, 319 (1-2). pp. 62-73. ISSN 0925-8388 (doi:https://doi.org/10.1016/S0925-8388(01)00909-4)
titanium composite
Chander, Prakash, Sunpreet, Singh, Seeram, Ramakrishna, Grzegorz, Królczyk and Le, Chi H. ORCID: 0000-0002-5168-2297 (2020) Microwave sintering of porous Ti-Nb-HA composite with high strength and enhanced bioactivity for implant applications. Journal of Alloys and Compounds, 824:153774. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2020.153774)
wetting
Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C., Islam, M. and Lu, Hua ORCID: 0000-0002-4392-6562 (2007) Effect of adding 0.3wt% Ni into the Sn-0.7wt% Cu solder - Part II: Growth of intermetallic layer with Cu during wetting and aging. Journal of Alloys and Compounds, 438 (1-2). pp. 122-128. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2006.08.071)
Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Lu, Hua ORCID: 0000-0002-4392-6562 (2007) Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: part I: wetting behavior on Cu and Ni substrates. Journal of Alloys and Compounds, 438 (1-2). pp. 116-121. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2006.08.048)
wetting force
Rizvi, M.J., Bailey, Christopher ORCID: 0000-0002-9438-3879 , Chan, Y.C. and Lu, Hua ORCID: 0000-0002-4392-6562 (2007) Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: part I: wetting behavior on Cu and Ni substrates. Journal of Alloys and Compounds, 438 (1-2). pp. 116-121. ISSN 0925-8388 (doi:https://doi.org/10.1016/j.jallcom.2006.08.048)