computer-aided design of microcircuits

Mallik, S., Bauer, R., Hübner, F. and Ekere, N.N. (2011) Evaluating print performance of Sn-Ag-Cu leadfree solder pastes used in electronics assembly process. In: International Conference on Advances in Materials and Processing Technologies (AMPT2010). AIP Conference Proceedings (1315/1). American Institute of Physics (AIP), Melville, NY, USA, pp. 33-38. ISBN 978-0-7354-0871-5 ISSN 0094-243X (doi:https://doi.org/10.1063/1.3552465)

contacts

Mallik, S., Bauer, R., Hübner, F. and Ekere, N.N. (2011) Evaluating print performance of Sn-Ag-Cu leadfree solder pastes used in electronics assembly process. In: International Conference on Advances in Materials and Processing Technologies (AMPT2010). AIP Conference Proceedings (1315/1). American Institute of Physics (AIP), Melville, NY, USA, pp. 33-38. ISBN 978-0-7354-0871-5 ISSN 0094-243X (doi:https://doi.org/10.1063/1.3552465)

device isolation

Mallik, S., Bauer, R., Hübner, F. and Ekere, N.N. (2011) Evaluating print performance of Sn-Ag-Cu leadfree solder pastes used in electronics assembly process. In: International Conference on Advances in Materials and Processing Technologies (AMPT2010). AIP Conference Proceedings (1315/1). American Institute of Physics (AIP), Melville, NY, USA, pp. 33-38. ISBN 978-0-7354-0871-5 ISSN 0094-243X (doi:https://doi.org/10.1063/1.3552465)

integrated circuits

Mallik, S., Bauer, R., Hübner, F. and Ekere, N.N. (2011) Evaluating print performance of Sn-Ag-Cu leadfree solder pastes used in electronics assembly process. In: International Conference on Advances in Materials and Processing Technologies (AMPT2010). AIP Conference Proceedings (1315/1). American Institute of Physics (AIP), Melville, NY, USA, pp. 33-38. ISBN 978-0-7354-0871-5 ISSN 0094-243X (doi:https://doi.org/10.1063/1.3552465)

interconnected systems

Mallik, S., Bauer, R., Hübner, F. and Ekere, N.N. (2011) Evaluating print performance of Sn-Ag-Cu leadfree solder pastes used in electronics assembly process. In: International Conference on Advances in Materials and Processing Technologies (AMPT2010). AIP Conference Proceedings (1315/1). American Institute of Physics (AIP), Melville, NY, USA, pp. 33-38. ISBN 978-0-7354-0871-5 ISSN 0094-243X (doi:https://doi.org/10.1063/1.3552465)

interconnects

Mallik, S., Bauer, R., Hübner, F. and Ekere, N.N. (2011) Evaluating print performance of Sn-Ag-Cu leadfree solder pastes used in electronics assembly process. In: International Conference on Advances in Materials and Processing Technologies (AMPT2010). AIP Conference Proceedings (1315/1). American Institute of Physics (AIP), Melville, NY, USA, pp. 33-38. ISBN 978-0-7354-0871-5 ISSN 0094-243X (doi:https://doi.org/10.1063/1.3552465)

layout and modeling

Mallik, S., Bauer, R., Hübner, F. and Ekere, N.N. (2011) Evaluating print performance of Sn-Ag-Cu leadfree solder pastes used in electronics assembly process. In: International Conference on Advances in Materials and Processing Technologies (AMPT2010). AIP Conference Proceedings (1315/1). American Institute of Physics (AIP), Melville, NY, USA, pp. 33-38. ISBN 978-0-7354-0871-5 ISSN 0094-243X (doi:https://doi.org/10.1063/1.3552465)

metallization

Mallik, S., Bauer, R., Hübner, F. and Ekere, N.N. (2011) Evaluating print performance of Sn-Ag-Cu leadfree solder pastes used in electronics assembly process. In: International Conference on Advances in Materials and Processing Technologies (AMPT2010). AIP Conference Proceedings (1315/1). American Institute of Physics (AIP), Melville, NY, USA, pp. 33-38. ISBN 978-0-7354-0871-5 ISSN 0094-243X (doi:https://doi.org/10.1063/1.3552465)

soldering

Mallik, S., Bauer, R., Hübner, F. and Ekere, N.N. (2011) Evaluating print performance of Sn-Ag-Cu leadfree solder pastes used in electronics assembly process. In: International Conference on Advances in Materials and Processing Technologies (AMPT2010). AIP Conference Proceedings (1315/1). American Institute of Physics (AIP), Melville, NY, USA, pp. 33-38. ISBN 978-0-7354-0871-5 ISSN 0094-243X (doi:https://doi.org/10.1063/1.3552465)

surface tension

Mallik, S., Bauer, R., Hübner, F. and Ekere, N.N. (2011) Evaluating print performance of Sn-Ag-Cu leadfree solder pastes used in electronics assembly process. In: International Conference on Advances in Materials and Processing Technologies (AMPT2010). AIP Conference Proceedings (1315/1). American Institute of Physics (AIP), Melville, NY, USA, pp. 33-38. ISBN 978-0-7354-0871-5 ISSN 0094-243X (doi:https://doi.org/10.1063/1.3552465)

Surface tension and related phenomena

Mallik, S., Bauer, R., Hübner, F. and Ekere, N.N. (2011) Evaluating print performance of Sn-Ag-Cu leadfree solder pastes used in electronics assembly process. In: International Conference on Advances in Materials and Processing Technologies (AMPT2010). AIP Conference Proceedings (1315/1). American Institute of Physics (AIP), Melville, NY, USA, pp. 33-38. ISBN 978-0-7354-0871-5 ISSN 0094-243X (doi:https://doi.org/10.1063/1.3552465)

Workshop procedures

Mallik, S., Bauer, R., Hübner, F. and Ekere, N.N. (2011) Evaluating print performance of Sn-Ag-Cu leadfree solder pastes used in electronics assembly process. In: International Conference on Advances in Materials and Processing Technologies (AMPT2010). AIP Conference Proceedings (1315/1). American Institute of Physics (AIP), Melville, NY, USA, pp. 33-38. ISBN 978-0-7354-0871-5 ISSN 0094-243X (doi:https://doi.org/10.1063/1.3552465)