computational fluid dynamics (CFD)

Dhinsa, Kulvir, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID: https://orcid.org/0000-0002-7426-9999 (2005) Investigation into the performance of turbulence models for fluid flow and heat transfer phenomena in electronic applications. IEEE Transactions on Components and Packaging Technologies, 28 (4). pp. 686-699. ISSN 1521-3331 (doi:10.1109/TCAPT.2005.859758)

Kay, Robert W., Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Glinski, Greg P., Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2007) Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process. IEEE Transactions on Components and Packaging Technologies, 30 (1). pp. 129-136. ISSN 1521-3331 (doi:10.1109/TCAPT.2007.892085)

electronic applications

Dhinsa, Kulvir, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID: https://orcid.org/0000-0002-7426-9999 (2005) Investigation into the performance of turbulence models for fluid flow and heat transfer phenomena in electronic applications. IEEE Transactions on Components and Packaging Technologies, 28 (4). pp. 686-699. ISSN 1521-3331 (doi:10.1109/TCAPT.2005.859758)

fluid flow

Dhinsa, Kulvir, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID: https://orcid.org/0000-0002-7426-9999 (2005) Investigation into the performance of turbulence models for fluid flow and heat transfer phenomena in electronic applications. IEEE Transactions on Components and Packaging Technologies, 28 (4). pp. 686-699. ISSN 1521-3331 (doi:10.1109/TCAPT.2005.859758)

heat transfer

Dhinsa, Kulvir, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID: https://orcid.org/0000-0002-7426-9999 (2005) Investigation into the performance of turbulence models for fluid flow and heat transfer phenomena in electronic applications. IEEE Transactions on Components and Packaging Technologies, 28 (4). pp. 686-699. ISSN 1521-3331 (doi:10.1109/TCAPT.2005.859758)

isotropic conductive adhesives (ICAs)

Kay, Robert W., Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Glinski, Greg P., Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2007) Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process. IEEE Transactions on Components and Packaging Technologies, 30 (1). pp. 129-136. ISSN 1521-3331 (doi:10.1109/TCAPT.2007.892085)

organic light emitting diodes (OLED)

Kay, Robert W., Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226, Glinski, Greg P., Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 and Desmulliez, Marc P.Y. (2007) Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process. IEEE Transactions on Components and Packaging Technologies, 30 (1). pp. 129-136. ISSN 1521-3331 (doi:10.1109/TCAPT.2007.892085)

turbulence models

Dhinsa, Kulvir, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis ORCID: https://orcid.org/0000-0002-7426-9999 (2005) Investigation into the performance of turbulence models for fluid flow and heat transfer phenomena in electronic applications. IEEE Transactions on Components and Packaging Technologies, 28 (4). pp. 686-699. ISSN 1521-3331 (doi:10.1109/TCAPT.2005.859758)