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Rizvi, M.J., Chan, Y.C., Bailey, C.
ORCID: 0000-0002-9438-3879
, Lu, H.
ORCID: 0000-0002-4392-6562
, Islam, M.N. and Wu, B.Y.
(2005)
Wetting and Reaction of Sn-2.8Ag-0.5Cu-1.0Bi Solder with Cu and Ni Substrates.
IEEE/TMS Journal of Electronic Materials, 34 (8).
pp. 1115-1122.
ISSN 0361-5235 (Print), 1543-186X (Online)
(doi:https://doi.org/10.1007/s11664-005-0239-6)