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Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S. and Ekpu, M. (2012) Finite element analysis of the effect of silver content for Sn–Ag–Cu alloy compositions on thermal cycling reliability of solder die attach. Engineering Failure Analysis, 28. pp. 192-207. ISSN 1350-6307 (doi:


Pesinis, Konstantinos and Tee, Kong Fah ORCID: 0000-0003-3202-873X (2017) Statistical model and structural reliability analysis for onshore gas transmission pipelines. Engineering Failure Analysis, 82. pp. 1-15. ISSN 1350-6307 (doi:

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