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electronic product assembly level set method multiphysics modeling solidification
Number of items: 4.

electronic product assembly

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Wheeler, D. (2001) Computational modeling techniques for reliability of electronic components on printed circuit boards. Applied Numerical Mathematics, 40 (1-2). pp. 101-117. ISSN 0168-9274 (doi:10.1016/S0168-9274(01)00065-4)

level set method

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Wheeler, D. (2001) Computational modeling techniques for reliability of electronic components on printed circuit boards. Applied Numerical Mathematics, 40 (1-2). pp. 101-117. ISSN 0168-9274 (doi:10.1016/S0168-9274(01)00065-4)

multiphysics modeling

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Wheeler, D. (2001) Computational modeling techniques for reliability of electronic components on printed circuit boards. Applied Numerical Mathematics, 40 (1-2). pp. 101-117. ISSN 0168-9274 (doi:10.1016/S0168-9274(01)00065-4)

solidification

Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 and Wheeler, D. (2001) Computational modeling techniques for reliability of electronic components on printed circuit boards. Applied Numerical Mathematics, 40 (1-2). pp. 101-117. ISSN 0168-9274 (doi:10.1016/S0168-9274(01)00065-4)

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