Browse by Journal Title
Jump to: A
Number of items: 1.
A
Amalu, E.H., Ekere, N.N. and Bhatti, R.S. (2010) High temperature electronics: R&D challenges and trends in materials, packaging and interconnection technology. In: 2nd International Conference on Adaptive Science & Technology, 2009. (ICAST 2009). Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 146-153. ISBN 978-1-4244-3522-7 ISSN 0855-8906 (doi:10.1109/ICASTECH.2009.5409731)