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Items where Author is "de Saint Leger, O."

Items where Author is "de Saint Leger, O."

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Conference Proceedings

Stoyanov, S. ORCID: 0000-0001-6091-1226 and Bailey, C. ORCID: 0000-0002-9438-3879 (2003) Optimization and finite element analysis for reliable electronic packaging. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-electronics and Micro-systems. Proceedings of EuroSimE 2003. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-399. ISBN 0780370546

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