Items where Author is "de Saint Leger, O."
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Conference Proceedings
Stoyanov, S.
ORCID: 0000-0001-6091-1226
and Bailey, C.
ORCID: 0000-0002-9438-3879
(2003)
Optimization and finite element analysis for reliable electronic packaging.
In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-electronics and Micro-systems. Proceedings of EuroSimE 2003.
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 391-399.
ISBN 0780370546