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Items where Author is "de Saint Leger, 0."

Items where Author is "de Saint Leger, 0."

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CFD circuit optimisation computational fluid dynamics computer modelling crack detection design of experiments electronic design automation finite element analysis flow simulation integrated circuit modelling integrated circuit packaging integrated circuit reliability integrated optoelectronics mechanical testing printed circuit testing optical backplanes optical planar waveguides optoelectronic packages resistors sensitivity analysis strain measurement surface emitting lasers thermal analysis thermal management (packaging) thermal stress cracking turbulence
Number of items: 26.

CFD

Dhinsa, K., Bailey, C. ORCID: 0000-0002-9438-3879 and Pericleous, K. ORCID: 0000-0002-7426-9999 (2004) Low Reynolds number turbulence models for accurate thermal simulations of electronic components. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 483-490. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304081)

circuit optimisation

Dhinsa, K., Bailey, C. ORCID: 0000-0002-9438-3879 and Pericleous, K. ORCID: 0000-0002-7426-9999 (2004) Low Reynolds number turbulence models for accurate thermal simulations of electronic components. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 483-490. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304081)

Gwyer, D., Misselbrook, P., Bailey, C. ORCID: 0000-0002-9438-3879 , Conway, P.P. and Williams, K. (2004) Polymer waveguide and VCSEL array multi-physics modelling for OECB based optical backplanes [opto-electrical circuit boards]. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 399-406. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304070)

computational fluid dynamics

Dhinsa, K., Bailey, C. ORCID: 0000-0002-9438-3879 and Pericleous, K. ORCID: 0000-0002-7426-9999 (2004) Low Reynolds number turbulence models for accurate thermal simulations of electronic components. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 483-490. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304081)

computer modelling

Gwyer, D., Bailey, C. ORCID: 0000-0002-9438-3879 , Pericleous, K. ORCID: 0000-0002-7426-9999 , Philpott, D. and Misselbrook, P. (2003) Modelling the assembly and performance of optoelectronic packages. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-electronics and Micro-systems. Proceedings of EuroSimE 2003. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 77-85. ISBN 0780370546

crack detection

Ridout, Stephen, Dusek, Milos, Bailey, Chris ORCID: 0000-0002-9438-3879 and Hunt, Chris (2004) Finite element modelling of crack detection tests. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 141-146. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304033)

design of experiments

Gwyer, D., Misselbrook, P., Bailey, C. ORCID: 0000-0002-9438-3879 , Conway, P.P. and Williams, K. (2004) Polymer waveguide and VCSEL array multi-physics modelling for OECB based optical backplanes [opto-electrical circuit boards]. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 399-406. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304070)

electronic design automation

Dhinsa, K., Bailey, C. ORCID: 0000-0002-9438-3879 and Pericleous, K. ORCID: 0000-0002-7426-9999 (2004) Low Reynolds number turbulence models for accurate thermal simulations of electronic components. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 483-490. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304081)

finite element analysis

Ridout, Stephen, Dusek, Milos, Bailey, Chris ORCID: 0000-0002-9438-3879 and Hunt, Chris (2004) Finite element modelling of crack detection tests. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 141-146. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304033)

Gwyer, D., Misselbrook, P., Bailey, C. ORCID: 0000-0002-9438-3879 , Conway, P.P. and Williams, K. (2004) Polymer waveguide and VCSEL array multi-physics modelling for OECB based optical backplanes [opto-electrical circuit boards]. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 399-406. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304070)

flow simulation

Dhinsa, K., Bailey, C. ORCID: 0000-0002-9438-3879 and Pericleous, K. ORCID: 0000-0002-7426-9999 (2004) Low Reynolds number turbulence models for accurate thermal simulations of electronic components. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 483-490. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304081)

integrated circuit modelling

Dhinsa, K., Bailey, C. ORCID: 0000-0002-9438-3879 and Pericleous, K. ORCID: 0000-0002-7426-9999 (2004) Low Reynolds number turbulence models for accurate thermal simulations of electronic components. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 483-490. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304081)

integrated circuit packaging

Dhinsa, K., Bailey, C. ORCID: 0000-0002-9438-3879 and Pericleous, K. ORCID: 0000-0002-7426-9999 (2004) Low Reynolds number turbulence models for accurate thermal simulations of electronic components. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 483-490. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304081)

integrated circuit reliability

Dhinsa, K., Bailey, C. ORCID: 0000-0002-9438-3879 and Pericleous, K. ORCID: 0000-0002-7426-9999 (2004) Low Reynolds number turbulence models for accurate thermal simulations of electronic components. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 483-490. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304081)

integrated optoelectronics

Gwyer, D., Misselbrook, P., Bailey, C. ORCID: 0000-0002-9438-3879 , Conway, P.P. and Williams, K. (2004) Polymer waveguide and VCSEL array multi-physics modelling for OECB based optical backplanes [opto-electrical circuit boards]. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 399-406. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304070)

mechanical testing printed circuit testing

Ridout, Stephen, Dusek, Milos, Bailey, Chris ORCID: 0000-0002-9438-3879 and Hunt, Chris (2004) Finite element modelling of crack detection tests. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 141-146. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304033)

optical backplanes optical planar waveguides

Gwyer, D., Misselbrook, P., Bailey, C. ORCID: 0000-0002-9438-3879 , Conway, P.P. and Williams, K. (2004) Polymer waveguide and VCSEL array multi-physics modelling for OECB based optical backplanes [opto-electrical circuit boards]. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 399-406. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304070)

optoelectronic packages

Gwyer, D., Bailey, C. ORCID: 0000-0002-9438-3879 , Pericleous, K. ORCID: 0000-0002-7426-9999 , Philpott, D. and Misselbrook, P. (2003) Modelling the assembly and performance of optoelectronic packages. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-electronics and Micro-systems. Proceedings of EuroSimE 2003. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 77-85. ISBN 0780370546

resistors

Ridout, Stephen, Dusek, Milos, Bailey, Chris ORCID: 0000-0002-9438-3879 and Hunt, Chris (2004) Finite element modelling of crack detection tests. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 141-146. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304033)

sensitivity analysis

Ridout, Stephen, Dusek, Milos, Bailey, Chris ORCID: 0000-0002-9438-3879 and Hunt, Chris (2004) Finite element modelling of crack detection tests. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 141-146. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304033)

strain measurement

Ridout, Stephen, Dusek, Milos, Bailey, Chris ORCID: 0000-0002-9438-3879 and Hunt, Chris (2004) Finite element modelling of crack detection tests. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 141-146. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304033)

surface emitting lasers

Gwyer, D., Misselbrook, P., Bailey, C. ORCID: 0000-0002-9438-3879 , Conway, P.P. and Williams, K. (2004) Polymer waveguide and VCSEL array multi-physics modelling for OECB based optical backplanes [opto-electrical circuit boards]. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 399-406. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304070)

thermal analysis

Dhinsa, K., Bailey, C. ORCID: 0000-0002-9438-3879 and Pericleous, K. ORCID: 0000-0002-7426-9999 (2004) Low Reynolds number turbulence models for accurate thermal simulations of electronic components. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 483-490. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304081)

thermal management (packaging)

Dhinsa, K., Bailey, C. ORCID: 0000-0002-9438-3879 and Pericleous, K. ORCID: 0000-0002-7426-9999 (2004) Low Reynolds number turbulence models for accurate thermal simulations of electronic components. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 483-490. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304081)

thermal stress cracking

Ridout, Stephen, Dusek, Milos, Bailey, Chris ORCID: 0000-0002-9438-3879 and Hunt, Chris (2004) Finite element modelling of crack detection tests. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 141-146. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304033)

turbulence

Dhinsa, K., Bailey, C. ORCID: 0000-0002-9438-3879 and Pericleous, K. ORCID: 0000-0002-7426-9999 (2004) Low Reynolds number turbulence models for accurate thermal simulations of electronic components. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 483-490. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304081)

This list was generated on Thu Nov 21 16:26:54 2024 UTC.