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Items where Author is "Yin, C.Y"

Items where Author is "Yin, C.Y"

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Flex-No-Lead project flexible-substrates lead-free soldering
Number of items: 3.

Flex-No-Lead project

Rizvi, M.J., Yin, C.Y ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2007) Performance and reliability of flexible substrates when subjected to lead-free processing. In: 16th European Microelectronics and Packaging Conference and Exhibition 2007(EMPC 2007). Curran Associates, Inc., Red Hook, NY, USA, pp. 589-594. ISBN 9781622764662

flexible-substrates

Rizvi, M.J., Yin, C.Y ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2007) Performance and reliability of flexible substrates when subjected to lead-free processing. In: 16th European Microelectronics and Packaging Conference and Exhibition 2007(EMPC 2007). Curran Associates, Inc., Red Hook, NY, USA, pp. 589-594. ISBN 9781622764662

lead-free soldering

Rizvi, M.J., Yin, C.Y ORCID logoORCID: https://orcid.org/0000-0003-0298-0420, Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2007) Performance and reliability of flexible substrates when subjected to lead-free processing. In: 16th European Microelectronics and Packaging Conference and Exhibition 2007(EMPC 2007). Curran Associates, Inc., Red Hook, NY, USA, pp. 589-594. ISBN 9781622764662

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